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productroundup Integrated gate drivers with on-chip galvanic isolation The STGAP1S advanced single-channel gate driver from STMicroelectronics integrates galvanic isolation with analogue and logic circuitry in the same chip to help simplify driver design while ensuring high noise immunity for safe and reliable power control. STGAP1S is the first in ST’s new generation of gapDRIVE gate drivers, which combine proprietary bipolar- CMOS-DMOS (BCD) process technology with an isolation layer grown on-chip to allow greater system integration. Up to 1500V can be present on the high-voltage rail without interfering with other circuitry, ensuring a level of robustness that makes this device suitable for use in industrial drives, high-power 600V or 1200V inverters, solar inverters, and uninterruptible power supplies. With signal-propagation delay of 100 nsec across the isolation layer, the STGAP1S is capable of transmitting high-accuracy PWM signals. The integrated driver stage can sink or source up to 5A. J-Link on-board adds Drag & Drop applications programming Segger has introduced a Drag & Drop “intuitive programming" Complete article, here feature to its J-Link OB single-chip on-board debug probe. A J-Link OB with Drag & Drop capability appears both as a debug probe and as a flash drive on the user’s computer. The J-Link's performance and functionality for programming and debugging remain unchanged; the additional flash drive capability simplifies programming the target to dragging a Motorola S-record, Intel Hex, or plain binary file onto the J-Link Drive using the desktop. J-Link Drive enables manufacturers, and third-party software developers, to deploy ready-to-go demonstration applications to customers who can then quickly evaluate the capability of the board, software, and device—all without installing complex development software. FPGA-based functional safety boards, Altera IP and reference designs FPGAs and IP, with a functional safety development board from NewTec, speed time to market for IEC61508 functional safety applications: reference designs reduce SIL 3 development and certification costs for industrial designs. Altera has announced a functional safety development board and FPGA reference designs through NewTec, provider of safety-related systems. The board and reference designs, coupled with Altera’s TÜV Rheinland-qualified FPGAs, tools, and IP, enable users to accelerate development and certification of FPGA-based system designs. Altera’s functional safety data package includes device support, enhanced software design flows and IP for functional safety system design, allowing designers using Cyclone FPGAs to reduce risks and cost-effectively meet safety-critical system requirements across product lines. The functional safety board and accompanying reference designs are designed by Altera and NewTec to reduce customer design effort for safety designs requiring IEC 61508 certification up to SIL 3 (safety integrity level 3). Complete article, here 120A from a TO-247 package; TO-247PLUS for IGBTs Infineon’s TO-247PLUS package carries up to a 120A IGBT co-packed with a full rated diode in the same footprint and pin-out as JEDEC standard TO-247-3. The TO-247PLUS can be used in industrial applications such as UPS, welding, solar, industrial drives as well as automotive applications such as powertrain inverter to upgrade existing designs for higher power output or to improve the thermal conditions in the application. The higher current capability of the TO-247PLUS allows for reducing the number of devices in parallel thus enabling more compact product designs. Due to the absence of the mounting hole the TO-247PLUS package may accommodate a 70% larger silicon die area compared to standard TO-247. Additionally, the 26% larger thermal pad area contributes up to a 20% lower thermal resistance Rth (jh) compared to standard TO-247. Complete article, here Complete article, here 22 EDN Europe | DECEMBER 2014 www.edn-europe.com


EDNE DEC 2014
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