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EDNE JAN 2017

productroundup MEMS sensors for activity/fitness apps adds compass STMicroelectronics has assembled a package of motion sensors for “social-fitness” activity-tracking devices, promising additional smart functions, better accuracy, longer battery life, and faster time to market. An enhanced “eCompass” boosts dead-reckoning tracking precision. These sensors, the LIS2DS12 3-axis “pico” accelerometer, LSM6DSL/M 6-axis inertial module, and the new LSM303AH eCompass help track movement continuously with minimal impact on battery life by performing motion-related calculations onchip instead of using the main system processor. 7th generation Intel Core on COM Express modules Avnet Embedded has announced the MSC C6C-KLU and MSC C6BKLH Type 6 COM Express module families based on the 7th generation Intel Core processors (codenamed “Kaby Lake”). Designed and manufactured by MSC Technologies (an Avnet Company) in Germany, these COM Express modules offer at least a 7-year lifecycle from the date of introduction. The 95 x 95 mm units draw between 17W and 19W, typical with operating temperature from 0° to 60°C. Four variants use the dual-core processors Intel Core i7-7600U, i5-7300U, i3-7100U, and Intel Celeron 3965U. Complete article, here Software client enables device-device IoT communications Segger’s MQTT client implementation helps IoT devices to communicate with each other, using wired or wireless connections, anywhere that is accessible by internet protocol. The lightweight communication is suited constrained environments such as IoT and machine to machine (M2M) contexts. Its minimal size, in terms of both RAM and ROM, means it fits onto resource-constrained embedded processors. Segger’s client implementation of the MQTT protocol implements version 3.1.1 of the OASIS standard and talks to any compliant MQTT broker. Complete article, here Low-temp solder & polyester substrates form cost-effective flexies Molex has introduced Solder on Polyester Substrate, offering it as a flexible, economical alternative to rigid PCB and polyimide. The technology, Molex says, delivers cost-effective circuitry supporting highdensity surface-mount components. Surface Mount (SMT) components, including fine-pitched ICs are attached with low-temperature solder and encapsulated on a polyester substrate. Custom designed products can be used for capacitive touch buttons, capacitive fluid level sensors and membrane switches in consumer, medical and industrial applications. Complete article, here Complete article, here 32 EDN Europe January 2017 www.edn-europe.com


EDNE JAN 2017
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