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EETE APRIL 2013

Maintaining investment security with intelligent packaging By Christoph Adam System de vel opment and man ufact ure set a wide variety of challenges - all the way from product concept through to final delivery. The choice of the appropriate packaging technology often forms the basis for an efficient end product. The following example clearly demonstrates how an experienced outsourcing partner can contribute to the implementation of technologically optimised system solutions with the help of successive integration levels – from Level 1 (packaging units such as side panels, flanges, and connecting rails) up to Level 5 (system integration through to delivery to the end customer). The starting point for this project was the customer’s request for Standard 19”Racks, in this case a mounting kit for a CompactPCI system which was to be supplied by Heitec “off the shelf”. Further integration of the electronics for the Laser Direct Imaging (LDI) system was planned to be implemented by the manufacturer. The application Laser Direct Imaging (LDI) systems are used in the production of PCBs. Their advantage lies in their precision, sensitivity and the resulting excellence of picture quality. During the process a Laser beam is focussed directly at the varnished circuit board and exposes it. The Laser is then moved on – and thus draws the interconnects. This method is particularly suitable for low volume production and for high-density boards. Correspondingly, systems must fulfil stringent deployment requirements – for example the meeting of clean room specifications, precision in operation and extremely high levels of failsafe. Further important aspects apply to temperature management with respect to high currents, ventilation and electromechanical compatibility (EMC). This extremely complex electronic system – which includes various architectures, bus systems, interfaces and the adaptation of high resolution optics with a sophisticated lens system must be housed so accurately in the case that operation can be achieved at the lowest possible production cost. This means that every single aspect of the system concept must take the complete requirements of the target application into consideration to achieve an optimum, customised result. Integration Heitec was able to deliver the standard components immediately. However, upon further analysis of the system architecture Christoph Adam is Head of Product Management, Electronic Division, Heitec AG – www.heitec.de – He can be reached at info@heitec.de Powerful? …then you are right here! The marketplace for developers and innovators. Future starts here! PCIM_2013_ANZ_E_190x90 14.03.13 19:46 Seite 1 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management Nuremberg, 14 – 16 May 2013 More information at +49 711 61946-0 pcim@mesago.com or pcim-europe.com www.electronics-eetimes.com Electronic Engineering Times Europe April 2013 43


EETE APRIL 2013
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