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EETE APR 2015

Cyber-physical systems as the basis for IoT: Europe has it all By Julien Happich 15 European partners including research labs and high tech companies are joining their forces within the newly formed pan-European consortium EuroCPS, with a particular focus on the use of proven cyber-physical system (CPS) platforms to develop new IoT products. Funded by the European Commission and coordinated by French research lab CEA-Leti, the three-year, 9.2 million project is designed to help innovators (SMEs and large companies) overcome barriers they face when entering new markets because they lack both knowledge of the value chain and the skills to master the entire design process from ideas to products. To that end, EuroCPS partners will provide technical expertise, coaching and access to advanced industrial CPS platforms to get innovators up to speed on the innovation ecosystem of smart products by facilitating access to the latest technologies and their implementation. In the process, it will offer all the necessary expertise and competencies to provide innovators from any sector with a smooth path to building innovative CPS-enabled systems. It also will tap existing regional ecosystems in several countries to bring the full value chain from hardware/software platforms to cyber-physical systems to high value-added products and services. EuroCPS will create synergies between emerging and established organizations operating in the CPS sector, said Marie-Nolle Semeria, CEO of Leti in a statement. From that foundation, it will leverage the existing ecosystem to bring the full value chain from microelectronics, smart systems and CPS to high value-added products and services. This combination will centralize in one project all the necessary expertise and competencies to provide SMEs from any sector with a one-stop-shop opportunity to build innovative CPSenabled systems. As ICT becomes increasingly integrated into our everyday environment, the design of embedded ICT from components to CPS becomes more important than ever, not only for the ICT supply industry but also for all major mainstream sectors of the economy. Embedded systems and more particularly CPS are key enablers of innovation in European industry, and SMEs are the primary drivers of job creation. By integrating SMEs into the CPS sector and helping them develop innovative www.electronics-eetimes.com products more rapidly, EuroCPS is expected to foster job growth and create sustained demand for European manufacturing, especially as the IoT creates demand for new products. One key goal of the project is to link software, system and nano-electronic industries along the full CPS value chain to demonstrate a new cooperation model. TRENCH SiC MOSFET nLow RDSON n Low Switching Loss n High-Speed Switching ROHM Semiconductor is the world´s first manufacturer that achieved the mass production of Trench SiC MOSFET. Compared to the conventional planar MOSFET, Trench SiC technology reduces ARDSOn value by half and provides higher current capability. SiC MOSFET contributes to reduce the size of system by more than 50% versus IGBT solutions. Trench SiC MOSFET P/N Package BVDSS VGSS RDSON ( VGS=18V ) ID SCT3022KL TO247, Bare die 1200V 22V / -10V 22 mΩ 95 A SCT3030KL TO247, Bare die 1200V 22V / -10V 30 mΩ 73 A SCT3040KL TO247, Bare die 1200V 22V / -10V 40 mΩ 55 A SCT3018AL TO247, Bare die 650V 22V / -10V 18 mΩ 120 A SCT3022AL TO247, Bare die 650V 22V / -10V 22 mΩ 92 A SCT3030AL TO247, Bare die 650V 22V / -10V 30 mΩ 70 A Applications: ROHM MOSFET are ideal in Switch Mode Power Supplies, Renewable Energy Inverters/Converters, EV/HV inverters and chargers. Technology for you Sense it Light it Power it ! www.rohm.com/eu


EETE APR 2015
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