042-043_EETE-VF

EETE DECEMBER 2012

DESIGN & PRODUCTS Nanium to offer Fan-In wafer-level Smartphone camera auto focus control IC packaging in volume on 300mm wafers The LC898212XA-MH from ON Semiconductor is an auto Nanium has extended its wafer-level packaging (WLP) offering focus (AF) control IC for the camera modules found in to include fan-in WLP volume production on 300mm wafers. smartphones. This innovative solution is highly integrated, Earlier this year, the company licensed Flip Chip International’s programmable and provides (FCI) Spheron Plated Cu fast, accurate auto focus Redistribution technology convergence while consum- to provide solutions for ing less power and generat- 300mm wafer-level chip ing less noise interference scale packaging (WLCSP) than competing solutions, using fan-in WLP pro- claims the manufacturer. The cesses. After completing LC898212XA-MH features digi- line setup and qualification tal logic with a closed loop control system and a function for for that technology, the company has added the capability to a positioning sensor. Its closed loop architecture provides for manufacture fan-in WLP products. “The conventional fan-in more accurate auto focus control while also lowering power variant of WLP on the silicon wafer, where all IOs are located on consumption relative to open loop solutions. The function for the die, offers a cost-effective solution for the required package a positioning sensor is a constant current digital-to-analogue size, IO count and performance of many IC products,” said Ar- converter (DAC) and gain adjustable operational amplifier mando Tavares, president of Nanium’s executive board. “By le- to ensure accurate sensing. The output of the positioning veraging our proven WLP processes and know-how, NANIUM is sensor is read by an integrated 10-bit ADC. Furthermore, now extending its service offer to cover the full range of wafer- the control circuit filter coefficients are adjustable via an I2C level packaging requests of our customers, fan-in and fan-out.” interface, allowing the LC898212XA-MH to be programmed Wafer-level chip scale packaging (fan-in WLCSP) enables low- for optimal convergence time when paired with various differ- cost manufacturing of small die sizes, with low I/O density, and ent actuators. This innovative new device also incorporates high performance. The technology includes the re-passivation, an improved pulse width modulation (PWM) drive system to redistribution (RDL), under-bump metallization (UBM), bumping, further lower power consumption while also minimizing noise test, laser marking, singulation, automatic inspection (AOI) and which can affect image quality. The LC898212XA-MH is pick and pack in tape and reel. housed in a lead-free, halogen-free WL-CSP 12-pin package. Nanium ON Semiconductor www.nanium.com www.onsemi.com Fanless industrial PC feature Intel Atom CPU for 24/7 operation Compact filtered inlet MPL has expanded its line of embedded industrial comput- for high ambient temperatures ers with the PIP6-11, featuring the Intel Atom Z530P CPU The C22F appliance inlet and filter series combines an IEC C22 that allows system operation from -20°C to +60°C and high temperature appliance connector with a high-quality pow- optionally even from er-line filter for use in applications with nominal currents up to -40 to +75°C without 16A at 75°C ambient and 20A throttling or the need at 65°C ambient. The unique of a fan. The PIP design provides higher tem- 6-11 is certainly a perature ratings over com- maintenance free parable filtered inlets, while design for 24/7 op- maintaining a similar compact eration, even at high size. The combination power temperatures and entry module integrates the under vibrations or EMC filter directly at the line shocks. The product family comes in three housing heights input, providing an optimal as well as in a IP67 housing, 62, 83, and 120mm. The units effect on electromagnetic have an internal 9-36VDC industrial power supply, reverse compatibility. The broad metal polarity and brownout protection. They also feature wake- flange features a large amount on-LAN functionality for system startup from a central point of contact area, which further optimizes filtering and shielding of the network. The PCs are equipped with SSD memory or effects. Wiring is done using quick-connect or solder terminals. extreme hard disks (rated from -30 to +75°C) and front LEDs The standard C20F and new C22F series are designed for oper- offer an efficient diagnosis. On-board interfaces include 5 ating currents up to 16A at 250 VAC according to IEC standards Gigabit Ethernet ports, 7 Hi-Speed USB 2.0 ports, 2 RS232 and 20A at 125/250 VAC according to UL standards. They are ports and one miniPCIe slot. There is also the option to have ENEC and cURus approved. The two series are available in a PCI-104 interface to install up to 4 expansion cards (up to standard and medical versions suitable for applications accord- 8 RS232/485, digital I/Os, etc.), or CAN, Profibus and other ing to IEC 60950, and medical applications according to IEC interfaces. 60601-1. Such applications include power distribution units, MPL AG servers, medical heating appliances and imaging systems. www.mpl.ch Schurter www.schurter.com 42 Electronic Engineering Times Europe December 2012 www.electronics-eetimes.com


EETE DECEMBER 2012
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