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DC/DC step-down converter delivers 1V to 5V to space applications The 3DPM0289 DC/DC step-down converter from 3D PLUS is based on a Buck topology and provides a unique solution for robust low power distribution systems. The 3D PLUS space qualified technology enables a 12.5x11x10mm footprint, making it suitable to supply ASICs, FPGA, microprocessors, memories or any other device powered from 1V to 5V in high reliability applications. The PoL Power Module operates over a wide input voltage range from 4.5V to 14V, providing up to 2A of output current with an efficiency higher than 90%. It offers the possibility to run in parallel configuration in order to increase the output current up to 4A as a single output providing very good dynamic performances. Only an external resistor is needed for output regulation and the module is fully protected against output overload, input under-voltage and internal overtemperature and radiation hardened by design. 3D PLUS www.3d-plus.com Multiprotocol I/O modules support flexible industrial production Belden has launched the LioN-Power Active I/O modules, a multiprotocol solution that meets both EtherNet/IP and PROFINET specifications for the Industrial Internet of Things (IIoT) and detects both input and output data directly in the machine. The IO-Link Master, with class A and B ports, provides options for eight IO-link interfaces and 16 direct inputs (DI) or eight direct outputs (DO) for increased flexibility and functionality. L-coded M12 power ports with compact design and optimized arrangement simplify plant installation and give engineers more options for connecting additional Lumberg Automation LioN-Power products. The new LioN-Power Active I/O modules meet application-specific regulations, including Underwriters Laboratories (UL) 61010-1 certification for safe implementation of electrical test and measurement equipment, and IP66 and IP67 ratings for protection against dust and immersion in water. The modules can be used with other Belden products, including the M12 power cordsets, 7/8”cordsets and the M8/M12 cordset portfolio, along with the mounting adaptor. Belden www.belden.com On Semi offers 16.2-megapixel CCD ON Semiconductor has developed a 16.2-megapixel chargecoupled device (CCD) full-frame image sensor intended for astronomical and scientific applications. The KAF-16200 makes use of 6.0-micron pixels with a transparent gate electrode and is intended for use in an APS-H (34.6 mm diagonal) optical format. There are 4500 by 3600 photoactive pixels designed for color or monochrome image sensing applications. Each pixel contains anti−blooming protection by means of a lateral overflow drain thereby preventing image corruption during high light level conditions. Microlenses are added for improved sensitivity on both color and monochrome sensors. The device provides a doubling of resolution compared with On’s current device addressing this segment. The KAF-16200 is available in a RoHS-compliant 32-pin CERDIP package, and is available in both monochrome and color configurations. ON Semiconductor www.onsemi.com 32-bit Renesas MCUs expand high-sensitivity touch key options Renesas Electronics is adding to its touch-based application options for home appliance, building, and industrial automation, with the RX130 group of MCUs; these 32-bit MCUs offer a more convenient development environment for cost-sensitive applications The RX130 Group of 32-bit MCUs allows embedded developers to incorporate both user interface (i.e., touch key) and system control capabilities in a single MCU. Developers working with capacitive touch-based applications can use Renesas’ second generation capacitive touch technology, with self- and mutual-capacitance capability, in an ultra-low power, lowcost 32-bit MCU fabric. The new RX130 Group combines sensitivity and noise tolerance, making it possible to develop touch keys employing a variety of cover materials, including thick acrylic, glass, wood, fabric, or stone, for use in a broad array of new applications. These include control panels for electric appliances used in locations where they are likely to get wet, home equipment employing recessed switches for a more attractive design, and industrial machinery that must be operated with gloves on for safety reasons. With the addition of the RX130 Group, Renesas’ lineup of touch key MCUs comprises 256 product versions in total, with flash memory capacities ranging from 64 kB to 512 kB and number of pins ranging from 48- to 100-pins. Pin compatibility and software compatibility are maintained between the RX231 and RX130, making it possible to reuse existing software resources and providing coverage for devices from mid- to low-end to high end. Renesas www.renesas.eu 44 Electronic Engineering Times Europe December 2015 www.electronics-eetimes.com


EETE DEC 2015
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