So-Light research project gives OLED technology a boost By Christoph Hammerschmidt Eleven German OLED companies and research institutions successfully completed the So-Light project which addressed the complete value chain, from primary materials to lighting applications. Within the project several promising innovations have been created which now will be introduced to markets. In the project, results were achieved in a large number of technology segments, including materials, processes and panel technologies. In the field of materials, Novaled and Sensient jointly developed a new p-doped hole transport system with potential for lower absorption and lower cost scaleability than previous materials. The jointly developed materials will be commercialized by Novaled.
 In addition, Novaled made significant progress towards a fully air-stable n-doped electron transport layer. After more R&D work it is expected that this will lead to a commercial offering.
Sensient developed new host materials for OLED emitter layers which gave rise to efficiency enhancements in a reference OLED. The University of Muenster, together with Sensient, synthesized new platinum(II)-complexes. Used as triplet emitters, they enabled outstanding high quantum efficiencies for Pt(II) complexes of up to 75% (for green) and high current efficiencies of up to 16cd/A (green-yellow colour). In the processes arena, semiconductor equipment manufacturer Aixtron and the Fraunhofer research institute for organic electronic materials, COMEDD, jointly optimized the OVPD (Organic Vapour Phase deposition) process on a Gen2 substrate size. In addition, Aixtron demonstrated a new high deposition rate process based on their novel STExS source concept. Evaporation rates of above 40 Angstrom/ second were achieved for the p-HTL system with significantly reduced thermal exposure of the materials involved. This will allow much faster processing of sensitive organic materials compared to the current conventional process technology. Ledon OLED Lighting developed an efficient and robust electrical contacting technology which also enabled better system efficiency and homogeneity.
 In addition the use of a special rear surface heat distribution unit gave rise to better OLED emission uniformity without materially altering the level profile of an OLED panel. Siteco manufactured a suspension luminaire containing OLEDs, point source LEDs and an exterior luminaire for building façade integration And BMG MIS developed a thin OLED backlight for LCD-signage application. These elements form the basis for a modular construction of ultra thin large area LCD- signage for the transportation business. The So-Light project has been supported and by the German federal research ministry with €14,7 million. « Coil on Module » chip package could help ramp-up adoption of dual interface smart cards ByJulien Happich Infineon has introduced a ‘Coil on Module’ chip package that the company says will simplify the assembly and manufacture of dual interface smart cards, for a faster adoption of contactless payment applications. Dual Interface cards, which are used for both contact-based and contactless applications, are a fast growing segment of the global payments industry. According to market research firm IMS, the share of dual interface cards used in the global payment chip card market could rise from 18.9% in 2012 to 70.5% by 2017 when over 3.5 billion payment and banking cards could be shipping. Currently, manufacturers of dual interface smart cards have to connect the chip module to the card’s embedded antenna via soldered connections or conductive paste. “Special equipment and rather costly investments are required to make that extra mechanical-electrical connection, and there is a capacity shortage to fulfil the growing market for dual interface cards” explained Thomas Rosteck, Head of the Business Line Secure Mobile & Transaction of Infineon’s division Chip Card & Security. “Our ‘Coil on Module’ solution enables card manufacturers to ramp up volumes with a simplified production process, better yield and overall lower manufacturing costs than with conventional dual interface modules” he added. The new ‘Coil on Module’ package combines a security chip and an antenna that makes a radio frequency connection to the antenna embedded on the plastic payment card, through inductive coupling. Thanks to the RF link, the ‘Coil on Module’ technology removes the need for a mechanical-electrical connection and makes the cards inherently more robust. It also simplifies card design and manufacturing, making it more efficient and up to five times faster than with conventional technologies, according to Infineon. The RF coupling technology used between the ‘Coil on Module’ package and the embedded antenna on the card is not new per se, admitted Rosteck. It took several years for Infineon to develop the ‘Coil on Module’ package, the technology shares some patents from French start up Smart Packaging Solutions (SPS) - www.s-p-s.com. 10 Electronic Engineering Times Europe February 2013 www.electronics-eetimes.com

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