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EETE FEBRUARY 2013

Imec introduces hyperpectral CMOS camera for snapshot and video imec has designed a prototype hyperspectral imager for snapshot and video acquisition. Being fast, compact and cost-efficient, the CMOS-based imaging systems comes with integrated hyperspectral filters suited for multiple industrial vision applications. The prototype hyperspectral imager captures an entire multispectral image at one discrete point in time. The imager is achieved by applying a hyperspectral filter in a novel tiled lay-out on a commercially available CMOS-based image sensor (CMOSIS CMV2000, 2 megapixel, max 340fps). The imager and off-the-shelf fore-optics simultaneously duplicates the scene onto each filter tile, acquiring multispectral image cubes of 256x256 pixels over 32 bands in the spectral range of 600-1000nm at up to 340 cubes per second—compliant to normal machine vision illumination levels. Imec’s line scan solution monolithically integrates hyperspectral filters on a CMOSIS CMV4000 imager (4 megapixel, max 180fps). It scans 100 spectral bands in the 600-1000nm wavelength range. The filter bandwidth (Full Width Half Max) is about 10nm across the spectral range, with a transmission efficiency of about 85%. The speed of the system corresponds to an equivalent speed of 2,000 lines per second, significantly exceeding current state-of-the-art hyperspectral sensors. imec www.imec.be USB 3.0 imaging solution supports up to 100 meters of optical cable Lumenera together with Icron Technologies have announced a joint solution to extend USB 3.0 cameras beyond the typical 20 meters of cable limitation for standard USB cables. Lumenera has addressed this issue with Icron’s 100 meter multimode fiber extender system for SuperSpeed USB 3.0. Lumenera’s Lt425 and Lt225 USB 3.0 cameras can be installed with Icron’s USB 3.0 Spectra 3022 100 meter optical extender. The combined solution leverages the high-bandwidth USB 3.0 interface to deliver high speed, high resolution images even at distances as far as 100 meters. This plugand play joint solution enables new applications for USB 3.0, plus facilitates versatility. The Lt425 and Lt225 offer highspeed streaming video and image capture using SuperSpeed USB 3.0 technology to ensure the fastest image delivery, up to 170 frames/s at maximum resolution. The industry proven CMOSIS CMV4000 and CMV2000 megapixel sensors with fully electronic global shutter capture excellent quality, high-speed images with zero blur. The fully locking USB 3.0 cabling and digital interface ensure a simple plug-and-play installation with no framegrabber required. The built-in camera memory delivers a dependable, reliable flow of images, without exception. Built-in FPGA-based image processing ensures the highest image quality without having to compromise on performance. Icron’s Spectra 3022 is a SuperSpeed USB 3.0 extension solution, which supports USB 3.0 5Gbps throughputs up to 100 meters via OM3 multimode fiber optic cabling. Lumenera www.lumenera.com Audio codec enhances smartphone sound quality Dialog Semiconductor plc has unveiled a ultra low power audio codec, designed to provide full range, high fidelity audio capture and playback to a variety of portable devices and audio accessories. Dialog’s DA7320 audio codec features a programmable Digital Signal Processor (DSP) to offload audio software from the host processor. The use of Dialog’s audio algorithms has been market proven by leading smartphone OEMs to help deliver a consistent and enhanced user experience under a wide variety of use cases. By using a multi-channel architecture that digitally mixes and routes multiple audio streams, combined with programmable N-band parametric equalisation (EQ) and Dynamic Range Compressor (DRC), Dialog’s technology ensures louder and cleaner audio delivery on headphone and speaker peripherals. A psychoacoustic bass boost (PBB) can be enabled for improved perceived low frequency response for playback on low cost small form factor speakers. DA7320 is the first release in a new family of products that will be expanded to include third party branded audio software, such as noise suppression, acoustic echo cancellation and microphone beamforming. The audio codec uses a single supply voltage of just 1.6 V, has an ultra-low power consumption of 3.85mW and supports common sample rates between 8 to 96 kHz in master and slave modes. The DA7320 comes in a 64 pin BGA package with a 0.5 mm pitch. It operates from -40 to +85°C. Dialog Semiconductor www.dialog-semiconductor.com Audio codec integrates single microphone noise/echo cancellation The TC94B24WBG audio codec from Toshiba Electronics Europe is a highly integrated single microphone noise cancellation (NC) and echo cancellation (EC) solution for high-quality voice on smartphones and portable devices. The TC94B24WBG is claimed to offer design flexibility, performance, and cost benefits so OEMs can better address challenges associated with multiple microphone audio processing. Besides processing the NC/EC algorithms, the high-performance, low-power general-purpose programmable DSP in the TC94B24WBG allows customers to implement their own software in the audio codec. This helps differentiate their products from the competition. Additionally, the highly integrated TC94B24WBG includes: a 2-channel AECM interface; a 4-channel DECM interface; a battery-conserving class-G headphone amplifier; ear speaker amplifier; asynchronous sampling rate converter; a 4-channel I2S interface; an I2C/SPI interface; and audio post processing (equalizer, dynamic range controller). It provides all of the audio inputs and outputs required by mobile and telephony products. The device interfaces with the audio I/O and the application processor in smartphones and tablets. The TC94B- 24WBG comes equipped with two analogue and four digital microphone inputs to suit various customers’ needs. However, Toshiba’s unique audio processing algorithm needs just one analogue microphone to efficiently provide NC and EC simultaneously. Outstanding noise cancellation on the TC94B24WBG is achieved through a Toshiba proprietary one microphone algorithm. Toshiba Electronics Europe www.toshiba-components.com www.electronics-eetimes.com Electronic Engineering Times Europe February 2013 27


EETE FEBRUARY 2013
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