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Safety Manual that reduces design risk and development time, allowing engineers to focus on their core competence.” To conform to functional safety, system manufacturers need to perform safety analysis not just at the system level, but also down to the device level. Safety analysis includes failure mode analysis, consideration of diagnostic methods, and assessment of its diagnostic coverage. Doing these tests and trying to get detailed test analysis from the device manufacturer is a significant burden. The RX631 and RX63N MCUs are high-performance, 32-bit MCUs that operate at 1.65 DMIPS/MHz, and include a floating point unit (FPU), hardware multipliers & MAC, flash operation without wait states, memory sizes up to 2MB of on-chip flash, and a rich set of peripherals such as multiple timers, high speed analogue, Ethernet connectivity, and built-in safetyrelated functions. By using the new functional safety solution, system manufacturers can easily apply functional safety to their systems using the RX631 and RX63N MCUs. The diagnostic coverage of the CPU core has undergone comprehensive fault simulation tests to make it easy to show the basis of the coverage estimation and enables effective system integration. The benchmarking of low power devices is also an issue, he says. “The message it totally confusing, many of my customers assume everything is low power,” said Skarin. “It’s a scattered picture.” There is also more consolidation set to happen. “We’ve seen Silicon Labs buy Energy Micro and Ember, NXP buy Code Red, the ARM acquisitions, I think we will see more consolidation and competition.” But that’s not necessarily from Intel with its Edison SD-sized PC and Galileo development board and Quark cores. “It’s all about the ARM market,” said Skarin. “There are a lot of x86 and MIPS legacy designs out there but if they move, they move into the ARM market,” he said. “The new competition coming you can bet will be ARMbased. The other risk is that you have a need for a global solution. I see a trend where US customers are bringing development back from China, India, the Ukraine and this means customers need a global solution, not different stacks or RTOS in different regions. There are few global players in this area,” said Skarin. IAR’s ARM-based game controller development kit. www.electronics-eetimes.com International Conference and Exhibition on Integration Issues of Miniaturized Systems – MEMS, NEMS, ICs and Electronic Components Co-organizer: Part of the activities of: Vienna, Austria, 26 – 27 March 2014 smartsystemsintegration.com BE PART OF IT! Knowledge exchange Trends and innovations Networking Main conference topics: • 3D integration and interconnect technologies • Design of smart systems • Manufacturing of smart systems • System integration and packaging Register now at smartsystemsintegration.com/registration Further information: +49 711 61946-16 or smart@mesago.com


EETE FEB 2014
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