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EETE FEB 2016

FFTDI Chip - Bridging Technologies or nearly 25 years FTDI Chip has been developing innovative silicon solutions that enhance the way in which people interact with technology. The principal objective of the company is to ‘bridge technologies’ by presenting engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable the creation of next generation electronic designs delivering a combination of high performance, minimal utilisation of board real estate, low power budgets and very few external components. FTDI Chip’s long-established and continuously expanding Universal Serial Bus (USB) product line boasts such widely recognized product brands as the ubiquitous R-Chip series, plus the X-Chip, Hi- Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s multi award winning Embedded Video Engine (EVE) graphic controller ICs each incorporate display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these devices allows dramatic reductions in the development time and bill-of-materials costs involved in advanced Human Machine Interface (HMI) implementation. The first FT80X EVE series has now been joined by the FT81X series, which delivers higher resolution and improved video playback capabilities. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed to offer compatibility with its USB and EVE product lines. These MCUs (the FT90X and FT51 series) are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency. The company recently launched its latest product, NerO, via KickStarter (pictured). The objective of NerO is to address the fundamental drawbacks of the widely-used Arduino UNO R3 in terms of power delivery. By utilizing the KickStarter crowdfunding platform it has been possible to get the engineering community involved in this project right from the very beginning. As a fab-less semiconductor company, FTDI Chip partners with the world’s leading foundries. The company’s headquarters is Company Profile located in Glasgow (UK) and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip will be exhibiting at Embedded World 2016 (Hall 4A, Stand 326) - with visitors able to learn about its latest production innovations, as well as engaging in interactive demos. Come to our stand and find out how we can help you achieve better designs today. FTDI Chip Unit 1, 2 Seaward Place Centurion Business Park Glasgow, G41 1HH UK Tel: +44 (0) 141 429 2777 E-Mail (Sales): sales1@ftdichip.com Website: www.ftdichip.com Hall 4A, Stand 326 4 2016 Show Guide www.electronics-eetimes.com


EETE FEB 2016
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