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A32_EETimes_REV2.375x10.875_A32.qxd 12/7/15 2 Circuit analysis & debug DC-DC Converters Fluid flow/heat transfer CFD package updated Mentor Graphics has a new release of its FloEFD computational fluid dynamics product that offers improved accuracy and user productivity. Updated features in High Voltage to 500 VDC Out High Power to 50 Watts NEW HiQP Input Voltage Available! 125-475 VDC Input Regulated/Isolated QP HiQP Series Isolated Standard Input Ranges 5, 12, 24, 48 & Now HiQP! 125-475 VDC High Voltage, Isolated Outputs 5 VDC-500 VDC to 50 Watts, Efficiency to 90% Consult Factory for Custom Modules: Available to optimize your designs, Special Input or Output Voltages Available Miniaturized Size package: 63,5mm x 39.37mm x 12.7mm Safe: Short Circuit, Over/Under Voltage, and Over Temp. Protected Options Available: Expanded Operating Temperature, -550C to +850C Environmental Screening, Selected from MIL-STD-883 Ruggedized for Operation in Harsh Environments External Bias Control: For Charge Pump Applications Rely on Pico for Thousands of ULTRA Miniature, High Reliability DC-DC Converters, AC-DC Power Supplies, Inductors and Transformers www.picoelectronics.com E-Mail: info@picoelectronics.com PICO Electronics,Inc. 143 Sparks Ave, Pelham, NY 10803-1837, USA Call 800-431-1064 Pico Representatives Germany ELBV/Electra Bauemente Vertrieb E mail: info@elbv.de Phone: 49 089 460205442 Fax: 49 089 460205442 England Ginsbury Electronics Ltd E-mail: rbennett@ginsbury.co.uk Phone: 44 163 429800 Fax: 44 163 4290904 this new version include improved mesh handling, an enhanced transient solver, a robust EDA interface, and an interface to Abaqus Finite Element Analysis (FEA) software for stress analysis. The package targets engineers and specialists across the automotive, aerospace and electronics markets. The latest version of the FloEFD product offers new capabilities for minimising user time and effort spent on meshing. The FloEFD tool can automatically fill gaps of specified size to quickly make the model watertight, thereby eliminating the time and necessity to adjust the original geometry. An equidistant refinement capability lets users build multilevel uniform meshes around the body or surface of the model with just one click. Mentor Graphics www.mentor.com Power insights for ULP projects on Atmel MCUs Targeting ultra-low-power (ULP) designs for internet of things, wearables and other applications requiring extremely low power, debug tools from Atmel enable developers to identify and eliminate power spikes during development. The high-accuracy debugging tool enables users to visualise the power usage of their product during the development cycle; being able to locate code where power spikes occur is crucial for supporting extremely low power in the overall design. The Power Debugger is Atmel’s latest development tool for debugging and programming Atmel | SMART ARM Cortex-M–based MCUs and Atmel AVR MCUs that use JTAG, SWD, PDI, debugWIRE, aWire, TPI or SPI target interfaces. In addition to standard low-level debug functionality, the Power Debugger features two independent current-sensing channels for collecting real-time power measurements during application execution. Atmel www.atmel.com Extended debug support for RL78 in IAR’s IDE Support for the C-STAT static analysis tool, as well as stack usage analysis, is introduced by the latest release of IAR Embedded Workbench for Renesas’ RL78 MCUs. This version of IAR Embedded Workbench for Renesas RL78 embedded development tools includes functionality enabling simplified development and increased code quality control for applications based on Renesas low-power RL78 microcontrollers. The add-on C-STAT product for static analysis is now supported. C-STAT features static analysis that can detect defects, bugs, and security vulnerabilities as defined by CERT C/C++ and the Common Weakness Enumeration (CWE), as well as help keeping code compliant to coding standards such as MISRA C:2004, MISRA C++:2008 and MISRA C:2012. IAR Systems www.iar.com www.electronics-eetimes.com Electronic Engineering Times Europe January 2016 35


EETE JAN 2016
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