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EETE JULAUG 2012

INTEGRITY moves onto Xilinx Zynq FPGas Green Hills Software has ported its real-time operating system (RTOS) platforms, high speed JTAG and trace-enabled processor probes and integrated development environment to the Xilinx Zynq-7000 extensible processing platform (EPP). The Xilinx Zynq-7000 EPP tightly integrates a complete ARM dual-core Cortex-A9 MPCore processor-based system with low-power programmable logic for system archi- tects and embedded software developers to extend, customise, optimise, and differentiate their systems, by adding peripherals and accelerators into the program- mable logic. Green Hills Software’s extensive plat- form support for Zynq-7000 devices ranges from the embedded industry’s first multicore IDE, MULTI as well as symmetrical multiprocess- ing support in its INTEGRITY operating system plus its tightly integrated processor trace debugging support via the TimeMachine debugger and SuperTrace probe. The INTEGRITY real-time OS, MULTI C/C++ compilers, and IDE, along with JTAG and trace-enabled processor probe and TimeMachine debugger support for the Zynq- 7000 EPP are available now. Green Hills Software www.ghs.com FPGas and cSoCs that operate at 150 to 200ºC Microsemi announced that its field programmable gate arrays (FPGAs) and Smart- Fusion customizable system-on-chip (cSoC) solutions are now characterized at extreme operating temperatures ranging from 150 to 200ºC. The devices have already been deployed in down-hole drilling products, space systems, avion- ics equipment and other applications requiring high performance and the utmost reliability in extreme low and high temperature environments. “Components that are capable of highly reliable operation in extreme hot and cold temperatures are essential for oil exploration applications, aerospace and defense equipment, and other products used in harsh operating environments,” said Paul Ekas, vice presi- dent of marketing for Microsemi’s SoC product group. “Our new extreme tempera- ture solutions demonstrate our continued commitment to delivering consistently high quality solutions that address tough industry challenges.” Microsemi www.microsemi.com low power latticeECP4 FPGas start shipping Lattice Semiconductor has begun shipping the highest density member of the company’s next generation LatticeECP4 FPGA family to select customers. The new LatticeECP4 FPGA family offers the richest portfolio of low cost, low powermid-range devices under 200K LUTs, with high performance innovations such as 6G SERDES in low cost packages, powerful DSP blocks and built-in hard IP-based communication blocks. The highest density device in the family, the LatticeECP4-190, features 183K LUTs, 480 double data rate DSP multipliers (18x18), 5.8 Mbits of memory and twelve 6 Gbps SERDES channels, making it ideally suited for a broad range of cost- and power-sensitive wireless, wireline, video and computing applications. Lattice has released three flip- chip packages for the LatticeECP4-190 (676, 900 and 1152 pins) that are well suited for a wide range of applications. The LatticeECP4-190 FPGA offers high-speed CPRI and SRIO 2.1 interfaces and double data rate digital signal processing (DSP) blocks for building heterogeneous wireless networks. The LatticeECP4 FPGAs facilitate rapid construction of the latest 3G/4G metro basestations, small cell sta- tions, pico stations, microwave and millimeter-wave backhaul links. The LatticeECP4-190 FPGA also provides wireline access developers with 36 embedded clock and data recov- ery circuits to build high port density switches and routers using low power FPGAs. Lattice Semiconductor Corporation www.latticesemi.com www.electronics-eetimes.com Electronic Engineering Times Europe July/August 2012 45


EETE JULAUG 2012
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