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EETE JULAUG 2015

WL to PL, and new materials will have to be developed in combination with new processes before it can be adopted in volume. Yet, research efforts may be paying back fairly quickly, since moving to large FO-PLP may induce a packaging cost reduction ran-ging from 20 to 30%, according to the researcher. Rudolph Technologies’ Applications Manager of the Lithography System Group, Roger McCleary was more optimistic about the FO-PLP roadmap, hinting that his company would be ready to support preproduction of large panels as early as 2016, for a full production equipment readiness by 2017 in terms of redistribution layer lithography and the necessary metrology and compensation measures to handle warpage over 5mm. “There is no long term visibility in the semiconductor back-end industry, yet we expect Fan-Out packages to grow significantly”, he said, adding that as the packages get larger, they’ll reduce the piece Fig. 4: Fraunhofer IZM’s FO-PLP results on 610x457mm2 panels. count on traditional wafers and will push manufacturers to move to larger substrates if they are to achieve a lower cost per package. McCleary expects the company’s third generation of Jet- Step lithography equipment to handle panels as large as 650x550mm² (five times the area of a 300mm wafer), delivering a two-fold productivity gain versus 300mm wafer processing on its Stepper. He cited an estimated throughput of 107,113 dies per hour versus today’s 42,504 dies per hour. Chris Jones, Manager PVD Product Management at SPTS was less upbeat about FO-PLP. “2.5 and 3D die integration in high bandwidth packages is Semi packaging tech Fig. 5: A probable FO-WLP roadmap (source Yole Développement). happening now, but when will it move into broader markets?” he asked. “It’s all about cost, so could FO-WLP fill the gap?” Jones unveiled some modifications made on the company’s Sigma fxP PVD System to handle 200, 300 and 330mm wafers, but he was keen to point out the resolution and warpage issues of panel-level packaging. The final speaker, Kevin Yang, Director for Product Management Laser Processing at SUSS MicroTec presented his company’s large format patterning solutions using UV lithography and excimer Laser ablation. He acknowledged that although all platforms may coexist, the adoption of 450mm wafers was slow, which would probably make panel based packaging a faster growing alternative to reduce packaging costs. Nevertheless, he raised the question of panel standards and infrastructures, what sizes, what materials, what processes and equipment? He then detailed the specs and promising results obtained using the company’s ELP600, a room-sized excimer ablation system capable of handling substrates as large as 600x600mm. Samsung pledges to boost French tech By Julien Happich At a press conference held in Paris, Samsung Electronics’ President and Chief Strategy Officer Young Sohn pledged to invest massively in France and help young tech entrepreneurs develop new IoT solutions. The company who recently launched the Artik open IoT platform, consolidated its partnership with IoT network provider Sigfox by becoming a share holder of the French company. Sohn made the announcement shaking hands with Sigfox’ CEO Ludovic Le Moan and Anne Lauvergeon, chairwoman of the board. This was in recognition of Sigfox pioneering the IoT network infrastructure at a time when connected objects only had short range power-hungry options, and clearly a sign that Samsung wants to be part of the data mining rush. Sohn also announced the opening of a Samsung Strategy & Innovation Center in Paris and said the company was committed to a long term collaboration with the French Tech community for innovation in IoT, encouraging startups and mature industrial partners alike to leverage Samsung’s SmartThings Open Cloud together with the Artik IoT modules (which happen Left, Samsung Electronics’ President and Chief Strategy Officer Young Sohn is praised by French Minister of Economy, Finance and Industry Emmanuel Macron. 24 Electronic Engineering Times Europe July-August 2015 www.electronics-eetimes.com


EETE JULAUG 2015
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