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Sensors & Data Loggers Fig. 2: Activity monitoring analysis through data fusion (source: Movea) stop rushing to the platform, find out the updated ETA as well as alternate itineraries; or easily locating a store in a mall Sports applications Data fusion offers the ability to measure and track a wider array of sports and personal activities for advanced analyses of running, tennis, cycling, etc. making the mobile device the single entry to a brand new way of better knowing and improving yourself and what you do. By adding data fusion models to enhance sports applications, we can expect more groundbreaking developments in the very near future. An example of smart devices and applications enabled by data fusion is an intelligent multisport mobile accessory – see figure 2. Today, accessories and apps are very specialized-- for running, step counting, tennis game play analysis, etc. Now, imagine a simple wearable accessory, which you can wear at all times, that detects your activity and sport and automatically starts tracking your performance accurately. It then connects to the Web to upload your data to a service, shares info with your Fig. 3: Data fusion service inputs activity data from hardware device for third party use and application development (source: Movea) social network, builds a database of your different activities to better anticipate your actions next time and so on. Building such a smart accessory does present challenges. One potential difficulty is the management of third-party additions and the ability to make them easily accessible to the apps developers. Another is making such an ecosystem scalable, with tracked activities and other functionalities continuing to increase, under the current low power and cost efficiency constraints. With the advancements of software capabilities, we see more user-experience enhancing functions on mobile devices as illustrated in figure 3. A simple architecture at the hardware and software level enables application developers to take advantage of an extendable set of models to create compelling apps, while maintaining low power consumption and cost efficiency. To fully realize this potential, we need to foster collaboration among industry players so that our collective expertise can be used to enable people to use their mobile devices for every possible purpose. 3D image sensor chip enables touchless gesture control Infineon Technologies has released a family of 3D Image Sensor chips for implementation of touchless gesture recognition. Developed in cooperation with pmdtechnologies GmbH, the new chips are the first to combine a 3D image sensing pixel array with the digital conversion and control functionality needed to design very compact and accurate monocular systems for gesture recognition applications in computers and consumer electronics devices. The chips include a photosensitive pixel array, sophisticated control logic, digital interfaces with ADCs and digital outputs. The IRS1010C has a resolution of 160x120 pixels and the IRS1020C has a resolution of 352x288 pixels. Both are dynamically configurable via I²C interface, allowing adjustment in real time to changing lighting and operating conditions. The chips are delivered as bare die for integration with camera lens and Infra-Red (IR) illumination source in a camera module. Infineon Technologies www.infineon.com/3d-imaging Test card evaluates mobile device behaviour in extreme temperatures With the increase of M2M (Machine to Machine) communication, mobile device requirements are increasing as well. Comprion’s new test card helps confirm the proper functioning of mobile phones in extreme temperature zones, from the Arctic to the Sahara. M2M UICCs are perfect for devices that must perform in rough environments and meet extended lifetime expectations. The 64K/J LTE Test (U)SIM – M2M UICC examines mobile device behaviour at temperatures between -40 to +105°C, instead of the previously-required -25 to +85°C. Thus, the card meets the ETSI specification TS 102 671. Additionally, the M2M Test (U)SIM includes new LTE data fields and carries a GSM and a USIM application. The card supports 1.8V, 3V and 5V voltage classes and is available in the Plug-In/2FF format. Comprion www.comprion.com 34 Electronic Engineering Times Europe June 2013 www.electronics-eetimes.com


EETE JUNE 2013
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