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Rugged SBC offers flexible I/O for data processing in compact displays MEN Micro has launched a low power, rugged single board computer (SBC) with a 1.6GHz Atom processor that incorporates flexible I/O for demanding graphics environments. The SC27 is aimed at LCD TFT displays with screens from 7” to 15” and a maximum resolution of 1280 x 768 pixels and reliably operates in compact spaces where conditions are rugged, like in mass transportation, where the SBC can be used in driver consoles or for in-seat displays. Critical industrial controls also benefit from the rugged, compact structure and highly adaptable I/O of the SC27. The fanless SBC dissipates up to 7 Watts and includes a temperature sensor to monitor and control the display, enabling reliable operation over an extended temperature range of -40 degrees C to +85 degrees C. Up to 2 GB of DDR2 SDRAM memory, with an 800 MHz bus frequency, as well as 16 Mbits of boot Flash come standard on the SC27. The board also includes an mSATA slot with transfer rates of up to 3Gbit/s as well as a microSD slot via USB. For real-time data requirements, wireless communication via WiFi, WiMAX, GSM/ GPRS, UMTS, HSDPA and LTE can be provided via the PCI Express Mini Card and the microSIM card slot. Standard I/O includes a Fast Ethernet port via an M12 connector, two USB ports and a GPS Interface as well as an RS232 or RS422/485 interface. MEN Micro www.menmicro.com Bluetooth SoC only draws 3.8mA at transmission and reception With SmartBond, Dialog Semiconductor has released what the company claims to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which more than doubles the battery life of an app-enabled smartphone accessory or computer peripheral in comparison to competing solutions on the market. Designed to connect keyboards, mice and remote controls wirelessly to tablets, laptops or Smart TVs, the part number DA14580 will enable consumers to use innovative apps on their smartphones and tablets connected with watches, wristbands and smart tags, to “self-track” their health and fitness levels, locate lost keys and much more. SmartBond’s unique low power architecture draws just 3.8mA at transmission and reception, 50% less than other Bluetooth Smart solutions on the market according to the manufacturer, with a deep sleep current of under 600nA. This means a 225mAh coin-cell battery in a product sending 20 bytes of data per second would last 4 years and 5 months in comparison to just 2 years with previous generations of Bluetooth Smart technology. The DA14580 features a Power Management block, including a DC-DC converter and all the necessary LDOs, reducing the need for external components. The DA14580 comes in three different form factors, the smallest WLCS package measures 2.5x2.5x0.5mm. Dialog Semiconductor www.dialog-semiconductor.com Cadence launches massively parallel timing tool to speed SoC design Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable System-on-Chip (SoC) developers to speed timing closure and move chip designs to fabrication quickly. The Tempus Timing Signoff Solution leverages multi-processing and ECO features to achieve signoff faster than with traditional flows. The tool can scale to use up to hundreds of CPUs. The parallel architecture enables the tools to analyze designs in the hundreds of millions of instances without compromising accuracy. A new path-based analysis engine leverages multi-core processing to reduce pessimism. With its performance advantage, the Tempus Timing Signoff Solution enables broader use of path-based analysis. Multi-mode, multicorner (MMMC) analysis and physically-aware timing closure leverages multi-threaded and distributed timing analysis. The Tempus Timing Signoff Solution advanced capabilities can handle designs containing hundreds of millions of cell instances without compromising accuracy. Cadence Design Systems www.cadence.com Single chip integrates JTAG standards and mixed-signal test instruments Goepel electronic’s CION LX is a new generation of JTAG transceiver ICs that provides ultra-low voltage characteristics, offering a tester-per-pin architecture based on diverse Boundary Scan standards, in combination with additional digital and analogue test instruments. Various operation modes enable a wide range of applications of the IC as bus transceiver, pin driver and system monitor. For flexible signal adaptation, different Interface types with programmable transceiver parameters have been integrated into the chip. The CION LX was developed in 0.35 μm mixed-signal CMOS technology and provides four independent I/O ports. Each port can be individually operated in a voltage range from 0.9 V to 3.6 V. The integrated Boundary Scan architecture supports the standards IEEE 1149.1, IEEE 1149.6 and IEEE 1149.8.1, at a maximum TCK frequency of 100 MHz. In addition to the single-ended pins, the CION LX provides differential signals as well as interfaces with increased driver ability. Four operation modes enable the IC’s flexible utilization as purely serially controlled JTAG transceiver, parallel I/O buffer, latched bus transceiver, and pin driver. Instruments such as digitizer, arbitrary waveform generator, event counter, frequency meter and toggle detectors are integrated into the CION LX. These instruments can be accessed, depending on operation mode, either serially via the JTAG Test Access Port (TAP) or a parallel control bus. The instruments can be activated simultaneously to Boundary Scan operations and per test channel. For each channel, pull-up and pull-down resistors can be additionally connected. Moreover, there’s the opportunity to program the drivers‘ slew rates. Sampling now, the CION LX’s first series deliveries are planned for quarter three in 2013. A QFN housing with 116 pins will be used. Additionally, there will be a version with 64 pins compatible to the predecessor model Footprint. Goepel electronic www.goepel.com 48 Electronic Engineering Times Europe June 2013 www.electronics-eetimes.com


EETE JUNE 2013
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