Page 57

EETE JUNE 2013

High temperature multilayer stacked capacitors offer high temperature reliability KEMET has introduced the company’s new KEMET Power Solutions High Temperature (KPS HT) Multilayer stacked capacitors. KEMET’s KPS HT Series devices with an X8L dielectric utilize a proprietary lead-frame technology to vertically stack one or two Multilayer ceramic chip capacitors (MLCCs) into a single compact surface mount package. The two-chip vertically stacked device offers up to double the capacitance in the same or smaller design footprint, allowing for both component and board space reductions. Providing up to 10 mm of board flex capability, KPS HT Series capacitors are environmentally friendly and in compliance with RoHS regulations. They are also capable of Pb-Free reflow profiles and provide low ESR and ESL. Utilizing an X8L dielectric, these devices can provide reliable operation up to 150ºC and are well suited for high temperature filtering, bypass and decoupling applications. Typical markets include alternative energy, industrial/lighting, medical, telecommunications, automotive, and defense and aerospace. KPS HT Series stacked capacitors complement KEMET’s extensive high temperature product portfolio, with capacitance solutions available for extreme temperature applications up to 260ºC. Kemet www.kemet.com Heatsink housings avoid LEDs overheating Fischer Elektronik has expanded its product range of heat discharge housings by adding an additional housing series, the G LED range of U-shaped housing profiles, which are open on one side with integrated guide grooves to take LED line modules and slot-in cover plates or plexiglass discs. The plexiglass discs and LED line modules are fixed by means of the lid plates at the front, which are screwed onto the housing profile. The housing profiles also have external cooling ribs, which ensure that the heat is fully discharged to the environment. The G LED housing series is available as standard in three different versions and three lengths (50, 80, 100 mm), as well as in two surface versions (natural-coloured and black anodised). Other lengths, surfaces and types of mechanical processing and printing can be manufactured to the customer’s request. Fischer Elektronik www.fischerelektronik.de CMOS-based isolated gate drivers provide drop-in replacements for opto-drivers Silicon Labs has introduced the industry’s first digital CMOSbased drop-in replacement solution for optocoupler-isolated gate drivers (opto-drivers). The Si826x isolated gate drivers support up to 5 kV isolation ratings and up to 10 kV surge protection. Failure-prone optodrivers are a weak link in motor controls and other industrial power systems that require long-term reliability, extended warranties and fail-safe operation for up to 20 years. Opto-drivers are inherently limited by their inferior LED-based technology, which is subject to large output variations over input current, temperature and age. With the Si826x, less variabi-lity, especially in input turn-on current, simplifies system design since developers no longer need to anticipate aging effects. Based on Silicon Labs’ proven digital Isolation technology, the Si826x family is a pin- and footprint-compatible functional upgrade solution for commonly used opto-driver products. Si826x isolated gate drivers emulate the behavior of opto-drivers by modulating a high-frequency carrier instead of light from an LED. This simpler digital architecture provides a robust isolated data path that requires no special considerations or initialization at start-up. While the input circuit mimics the characteristics of an LED, the Si826x devices require less drive current, resulting in higher efficiency. The propagation delay time of Si826x devices is independent of the input drive current, resulting in consistently short propagation times (25 ns), smaller unit-to-unit variation and greater input circuit design flexibility. The propagation delay and skew of Si826x isolated gate drivers is ten-times lower than opto-drivers, which improves response time for feedback loops and enhances system efficiency. The chips also provide superior noise immunity for a robust glitchfree long-term performance in harsh, noisy environments. They are rated for gate drive voltages of up to 30V and a peak output current ranging from 0.6 to 4.0A. Silicon Labs’ www.silabs.com Freeform packaging technology flexibly encapsulates semiconductor sensors Independent package development and assembly specialists Sencio BV is bringing an extra dimension to sensor and MEMs encapsulation with the launch of its nCapsulate freeform packaging technology. nCapsulate uses transfer molding with a thermosetting compound that delivers better isotropy and thermomechanical stability than the thermoplastics of standard injection molding technologies. It combines this with special mold tools developed by Sencio and a toolshop partner. Together, these developments enable device encapsulation that delivers the same excellent protection as traditional packages but that can be formed into any shape required. For example, manufacturers can use nCapsulate to add mounting, alignment and support features to a standard package design, or embed Sensors or MEMs directly into plastic components such as tubes and system casings. According to Jurgen Raben, manager technology, research & innovation of Sencio BV, nCapsulate’s freeform nature helps manufacturers streamline or even eliminate post-encapsulation assembly steps to improve production efficiency and save money. Customers can combine nCapsulate with Sencio’s other functional packaging capabilities, such as the ability to expose sensor surfaces while protecting delicate integrated circuits, to create a functional packaging solution tailored to their precise needs. nCapsulate can be applied to leadframe based packaging as well as other substrates such as PCBs or ceramics. Sencio www.sencio.nl www.electronics-eetimes.com Electronic Engineering Times Europe June 2013 49


EETE JUNE 2013
To see the actual publication please follow the link above