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Host Card Emulation goes white-label Shortly after its acquisition of Metaforic, INSIDE Secure is to accelerate the adoption of mobile-based payments with the launch of a white-label Android application for Host Card Emulation (HCE). Dubbed the MatrixHCE, the application enables mobile payment application providers to accelerate time to market by using a pre-validated HCE payment functionality. Introduced on Android 4.4 (KitKat), Host Card Emulation (HCE) allows for contactless payments (and other services including loyalty programs, building access and transit passes) to be made directly between the consumers’ bank mobile application and the retailers point-of-sale, using NFC technology. It allows sensitive data used to facilitate transactions to be stored on, and accessed from, cloud servers rather than a mobile device and without the use of a hardware secure element. HCE therefore enables widespread deployment of mobile payments, which have previously been restricted by the limited deployment of hardware secure elements in mobile devices. Matrix- HCE supports the HCE payment standards announced by major payment brands such as Mastercard and VISA, in preparation for the global commercial rollout later this year. It benefits from the software obfuscation and whitebox encryption security technologies developed by Metaforic. These have successfully undergone extensive penetration tests at external security labs. MatrixHCE also embeds secure networking communication technologies to protect the exchanges between the cloud server and the mobile application, thereby further protecting banking and payment data. INSIDE Secure www.insidesecure.com TI/Xilinx silicon provides DSP/programmable capabilities in rugged VPX module CommAgility’s VPX-D16A4 is a rugged high performance DSP and FPGA based card in the compact VITA 65, 3U OpenVPX form factor. The module is intended for applications such as software defined radio (SDR) (including LTE, Remote Radio Head (RRH), WiMax and Cloud RAN), imaging or radar, and is suited to military or other harsh field deployment environments. The VPX-D16A4 is CommAgility’s first board in the rugged VPX form factor, and is available as either conduction-cooled or air-cooled versions. For flexibility in interfacing, it supports SRIO, Ethernet, CPRI and Multi- Gigabit Transceiver (MGT) to the backplane plus links to RF or analogue I/O. The board is based around a Texas Instruments (TI) TCI6638K2K KeyStone-based System-on-Chip (SoC) and a TI TMS320C6678 SoC, which between them contain sixteen C66x DSP cores and four ARM Cortex-A15 cores, as well as baseband and networking accelerators. The two SoCs are closely coupled with TI’s HyperLink bus as well as Gigabit Ethernet. Each device has its own 2 Gbytes DDR3 memory bank and a 20 Gbaud SRIO link to the VPX backplane. For additional I/O or co-processing, the main DSP is connected via PCI Express and the AIF2 CPRI interface to a Xilinx Kintex-7 K325T FPGA CommAgility www.commagility.com Embedded video engine addresses human machine interfaces The VM800P series Arduino-compatible development platform from FTDI Chip offers engineers everything they need to implement more effective human machine interfaces (HMIs), including not only display, audio and touch elements, but data processing aspects too. The boards can be programmed via the Arduino IDE (using a pre-programmed Arduino-compatible bootloader) with over 50 EVE sample applications provided, categorised into basic, intermediate and advanced levels. These include straight forward gauges and keyboards through to white goods/industrial controls. With comprehensive support for various Arduino libraries provided, every VM800P incorporates an FTDI Chip FT800 EVE graphic controller IC and its FT232R USB interface IC, as well as an ATMEGA328P 8-bit RISC-based microcontroller (running at 16MHz). Also featured are a touch-enabled display LCD panel, a backlight LED driver and an audio power amplifier along with a micro speaker. A choice of 3.5-inch, 4.3-inch and 5.0-inch display formats is available, replete with precision fitted bezels that help to ensure continued operation even in uncompromising industrial application settings. All VM800P units have a USB serial port for firmware upload and application communication, a battery-backed real time clock (RTC) for carrying out system timing and a micro-SD socket which is complemented by a 4GByte SD card containing the pre-loaded sample applications. FTDI www.ftdichip.com Infineon shrinks power modules for HEVs, EVs Having gathered experience with e-car projects such as BMW’s i3, Infineon has developed a new HybridPack power module for automotive inverters. The HybridPack Drive complements the company’s HybridPack and HybridPack 2 product family with improvements in terms of cost and space. Infineon’s highest priority in the development of power components is rising the switching speed for better energy efficiency, explained Carlos Castro-Serrato, Head of Application Engineering, Electric Drive Train. The HybridPack Drive module is equipped with faster-switching transistors, which translates into a 30% smaller form factor compared to the HybridPack 2 at the same performance. Small package size is particularly important for hybrid electric vehicles, since in this category the existing conventional engine occupies most of the space under the hood. The module, which contains 24 IGBTs and 24 diodes, can handle between 50 and 100kW. While earlier HybridPack modules are equipped with screw-mounted power connections, the new module has multi-function tabs that allow faster installation - an aspect relevant for volume production. The stray inductance has been reduced from 14nH to 10nH. Infineon www.infineon.com 56 Electronic Engineering Times Europe June 2014 www.electronics-eetimes.com


EETE JUN 2014
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