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Esof adds radar and EW modelling and verification Agilent Technologies’ EEsof EDA W1905 radar model library has been enhanced to simulate moving 3-D radar scenarios as well as phased-array adaptive beamforming. The new modelling capability saves design verification cost and accelerates deployment for radar system engineers. It also reduces dependence on expensive field testing and dedicated hardware emulators by realistically rendering radar and electronic warfare environments economically throughout the R&D process, using commercial design software and test equipment. The W1905 radar model library is available as a simulation option to SystemVue, Agilent’s platform for electronic system-level design. The enhancements add inertial modelling “layers” above the baseband radar signal processing references. They account for the 3-D positions, velocities, rotations and beamforming directions of each transmitter, receiver and target, allowing modellers to create and script meaningful airborne, shipborne and multi-static scenarios or environments. Together with models for dynamically steerable antenna arrays and adaptive digital beamforming, the effectiveness of radar architectures and counter-measures can be quickly assessed, while also accounting for clutter, jammers, interference and RF analog limitations. Agilent Technologies www.agilent.com Micro coaxial cable assemblies deliver enhanced signal integrity High Speed Interconnects (HSI), a full service cable extrusion and coaxial assembly manufacturer, announces increasing capabilities to solve custom, small form factor interconnect challenges. As engineers face the competing pressures of less board-space combined with the need for transfer speeds at microwave spectrum data rates, HSI has been ramping up their R&D efforts to provide the answer to both pressures. Both the coaxial construction, which includes the proprietary dielectric of the company’s micro coaxial solutions are extruded in-house to tight specifications, providing exacting performance up to 10 GHz, with micro-coaxial connector terminations down to 0.3 mm pitch, and fine wire, direct-to-board terminations down to 0.175 mm. The fine wire direct-to-board method provides unrivalled footprint dimensions and can be ruggedized with HSI’s proprietary strain relief process. And custom wired-to-board does not infer higher cost, in fact it can be lower than using exotic, hard to find, small footprint connectors. The company’s certifications are extensive, and include AS9100 revision C, ISO9001, IPC 610/620, ITAR Registration, and multiple MIL Specification compliances. HSI is factory-certified in North America to properly terminate to Hirose, IPEX, and JAE micro coaxial connectors. High Speed Interconnects (HSI) Step-down switcher offers very high www.highspeedint.com efficiency, handles cold-crank The LT8620 from Linear Technology is a 2A, 65V input capable 200°C automotive grade silicon capacitors come in die size 3D silicon passive components integrator IPDiA has developed a new range of capacitors called ATSC dedicated to ‘under the hood’ applications. The ATSC range meets the demand of automotive sensor manufacturers who are looking for long life components with performance preserved when exposed to harsh conditions. The devices feature an operating temperature range of -55°C to +200 °C and enable a size reduction by a factor of 10 compared with traditional technologies. These SiCaps are available in 0202, 0505 and 0605 case sizes with respectively 1nF, 47nF and 100nF capacitance. They yield an electrical breakdown voltage of 30V and very low leakage current (<0.5 nA at the working voltage and room temperature). They also show low loss factors (equivalent series resistance ESR <100 mW and equivalent series inductance ESL <250 pH). The ATS capacitors have been developed with a rated voltage of 16V, in order to meet automotive voltage rating requirements, specified at a minimum value of 14V, and have been qualified according to the Automotive Electronics Council requirements AEC-Q100. IPDiA www.ipdia.com synchronous step-down switching regulator. Synchronous rectification delivers efficiency as high as 95% while Burst Mode operation keeps quiescent current under 2.5μA in no-load standby conditions. The chip’s 3.4V to 65V input voltage range makes it ideal for automotive (single and dual battery) and industrial applications. Its internal high efficiency switches deliver up to 2A of continuous output current to voltages as low as 0.97V. The LT8620’s ultralow quiescent current makes it well suited for applications such as automotive “always-on” systems, which need to extend operating battery life. The LT8620’s unique design maintains a minimum dropout voltage of only 250mV at 1A under all conditions, enabling it to excel in scenarios such as automotive cold-crank. The device’s fast minimum on-time of only 30ns enables 2MHz constant frequency switching from a 16V input to a 1.5V output, enabling designers to optimize efficiency while avoiding critical noise-sensitive frequency bands. The LT8620’s 24-lead 3x5mm QFN or thermally enhanced MSOP-16E package and a high switching frequency keeps external inductors and capacitors small, providing a compact, thermally efficient footprint. Linear Technology www.linear.com www.electronics-eetimes.com Electronic Engineering Times Europe June 2014 57


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