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5V MCUs host ARM Cortex-M0+ core, and touch controller Aimed at smart appliances and industrial markets, Atmel’s | SMART SAM C family provides full 5V performance with integrated PTC. These MCUs combine 5V, DMA performance and a PTC with excellent moisture tolerance. They also integrate advanced analogue capability and offer EMI and ESD protection, suiting them for the smart appliance and industrial markets. By adding full 5V functionality on an ARM Cortex M0+ based core, along with upcoming support for the IEC 60730 Class B Safety Library, the new SAM C MCUs target industrial and white goods companies. The series incorporates the company’s proprietary smart peripherals and Event System, and are pin and codecompatible to the SAM D and SAM L series. The SAM C is supported by Atmel’s free integrated development environment Atmel Studio and program examples and drivers for all peripherals are available through the Atmel Software Framework. The SAM C Series; expands the ARM Cortex-M0+ based MCU with hardware divide and square root accelerator at 48 MHz; it offers large memories: SRAM up to 32 kB, and embedded Flash up to 256 kB; and supports 2.7V to 5.5V operating voltage. As well as the peripheral touch controller, the series incorporates company’s proprietary DMA with SleepWalking, Event System and SERCOM; dual 12-bit ADCs and a 16-bit Sigma Delta ADC; and dual CAN 2.0 with FD support. Atmel www.atmel.com Vicor packs 400W AC/DC front-end module in 9-mm profile Vicor’s VIA PFM AC-DC front-end modules are powerfactor corrected, high-power-density isolated converters that provide up to 400W at 24 or 48V in a 9-mm profile, module that Vicor terms Thermally Adept. VIA PFM AC-DC front-end converter modules achieve a power density of 8 W/cm³ (127 W/ in³) supplying an isolated, PFC regulated 24V or 48V SELV DC output at up to 400W from the universal AC input range of 85 to 264V with 93% peak efficiency. The VIA PFM is one-fifth the thickness of traditional 1U supplies, offering design advantages to power system architects challenged by size constraints. With its 9 mm thin profile and 36 mm width, the VIA PFM can be mounted on the sidewall of any typical 1U chassis, saving valuable real estate. Thermally adept VIA PFMs may be chassis mounted and conduction cooled to eliminate fans, thereby improving overall system reliability and further minimising the power system footprint. High density, high efficiency and low thermal resistance suit VIA PFM front-end modules to a wide range of end-market applications, including small cell wireless base stations, size constrained LED lighting applications, industrial and automation systems. Vicor www.vicorpower.com ADCs offer 14-/12-bit resolution, 200 Msps conversion Microchip Technology has added two families of high-speed A/D converters in the MCP37DX0-200 and MCP372X0-200 series comprising 12- and 14- bit pipelined A/D converters with a maximum sampling rate of 200 Msamples/ sec. The converters offer over 67 dB signal-to-noise ratio (SNR) and over 96 dB spurious free dynamic range (SFDR). These families operate at very low-power consumption of 338 mW at 200 Msps including LVDS digital I/O for the 12-bit devices and 348 mW for the 14-bit devices. Lower power-saving modes are available at 80 mW for standby and 33 mW for shutdown. The MCP37DX0-200 and MCP372X0-200 include various digital processing features that simplify system design, cost and power usage for designers. These families also include decimation filters for improved SNR and phase, offset and gain adjustment. Data is available through the serial DDR LVDS or parallel CMOS interface and configured via SPI. An integrated digital down-converter is included in the MCP37DX0-200 family making it applicable to communications functions. The 12-bit devices include an integrated noise-shaping requantiser which enables users to lower the noise within a given band of interest for improved accuracy and performance. Microchip www.microchip.com IC provides video and communication bridge from consumer to automotive interfaces The MB86R91 APIX Companion Chip enables addressing the growing number of in-car displays, provides an interconnection between consumer chips and automotive interfaces, while reducing costs. Socionext is the joint venture formed by combining the LSI/ SoC businesses of Fujitsu and Panalsonic. In one of its first announcements since starting its activities as a new venture, Socionext is addressing car makers who, it says, are increasingly turning their attention to powerful application processors made by major chip manufacturers from the consumer electronics sector. However, because these were not originally designed for automotive use, they are seldom equipped with the interfaces needed for this application. The Socionext MB86R91 APIX Companion Chip communication and video bridge is designed to offer vehicle manufacturers an automotive version to interconnect the growing number of in-car displays with consumer grade chips – while at the same time reducing costs. The MB86R91 APIX Companion Chip enables the connection of modern high-performance application processors via various standard interfaces, such as single or dual OpenLDI Flat Panel Display Links and DRGB888. The fully integrated High Speed APIX2 transmitters, with a downlink data rate of 3 Gbps and an uplink rate of 187.5 Mbps, allow up to three high-resolution remote displays to be connected in parallel. Socionext http://socionext.com 48 Electronic Engineering Times Europe June 2015 www.electronics-eetimes.com


EETE JUN 2015
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