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EETE MAR 2014

Reader O f f er 10 RIoTboards to give away for your connected applications This month, Freescale is giving away ten RIoTboards, worth 74 dollars each, for EETimes Europe’s readers to win. Designed to run Android operating systems efficiently or to run under Linux, the board is based on the Freescale i.MX 6Solo processor; using the ARM Cortex-A9 architecture. The RIoTboard platform also includes a rich set of peripherals including a 10M/100M/Gb Ethernet port, 1 USB 2.0 OTG High Speed and 4 USB 2.0 High Speed 2.0 Hosts, LVDS, HDMI and Parallel RGB interfaces, micro TF and SD card interfaces, analog headphone/microphone jacks, camera interface, serial ports, JTAG and boot configuration interfaces. This together with a low power consumption makes it fit for the design of IoT data hubs. Reducing system cost, board size and complexity with low power, the BOM-optimized platform includes not only the Freescale i.MX 6Solo processor running at speeds up to 1GHz, but also the Freescale Kinetis K20 MCU, the Freescale MMPF0100Power management integrated chip, 1GByte of 32-bit wide DDR3 at 800MHz and a 4GB eMMC. Freescale www.freescale.com Check the reader offer online at www.electronics-eetimes.com CMOS sensor supports portable HD video at 240 frames per second With its T4K82 13-megapixel BSI CMOS image sensor, Toshiba Electronics Europe will enable smartphones and tablets to record full HD video at 240 equivalent frames per second. Highspeed video recording generally results in underexposed images with short exposure times, making it difficult to increase the frame rate, explains the manufacturer. Toshiba’s T4K82 incorporates ‘Bright Mode’ technology that boosts image brightness by up to four times, realizing full HD video capture at 240 fps equivalent. ‘Bright Mode’ technology secures double the exposure time by adopting interlaced video output rather than the progressive output used by standard CMOS sensors. ‘Bright Mode’ also employs charge binning, which doubles the electrical charge of each pixel. This results in an image four times brighter than that from a CMOS sensor without ‘Bright Mode’. Toshiba will also provide an interlaceprogressive conversion program that enables users to offer high-quality progressive video with low image deterioration, without changing the frame rate. The new sensor has a pixel pitch of 1.12μm and satisfies the 1/3.07-inch optical format. Recommended module size is 8.5x8.5mm. A newly developed low power circuit design reduces power consumption to 82% that of the T4K37, a 13-megapixel sensor in mass production. Toshiba Electronics Europe www.toshiba-components.com congatec cuts COM Express board in half congatec has launched its first half sized COM Express module. The COM Express Mini Type 10 module, designed in the US for the German board maker, measures just 55 x 84 mm and uses Intel’s Atom E3800 ‘Bay Trail’ series of processors. The conga-MA3 comes in four different Intel Atom processor-based versions, ranging from the entry-level single-core Intel Atom E3815 with 1.46 GHz and a power consumption of 5 watts, up to the quad-core Intel Atom E3845 with 1.91 GHz and 10 watts maximum power consumption, all with an L2 cache shared by multiple cores and faster Intel HD graphics engine than the previous generation. With teh smaller board size, the lower thermal envelope is a key consideration for system architects. The Type 10 module pinout is a refresh of Type 1 and uses the single 220 pin A-B connector to take advantage of modern display interfaces. The congaMA3 can support either TMDS (HDMI/DVI) or DisplayPort as well as one LVDS channel. The conga-MA3 COM Express Mini module provides up to 8 GByte of fast DDR3L onboard memory with options for onboard eMMC as well. The eMMC supports an integrated wear levelling feature for high data security. congatec www.congatec.com Surface mount module adds IoT connectivity The world’s first surface mount multi-chip wireless M2M module supports four different protocols to link designs easily to the Internet of Things. The ConnectCore 6 developed by Digi International provides access to all of the features of the Freescale i.MX 6 Quad, i.MX 6 Dual and i.MX 6 Solo processors for M2M applications as the small form factor and design, which requires no connectors and reduces manufacturing costs. The ConnectCore 6 modules built-in ability to connect via Wi-Fi, Bluetooth, Bluetooth Low Energy and Device Cloud by Etherios can save product designers hundreds of hours of time and expense in designing wireless devices including the pain of passing and maintaining global certifications. Complete software development tools are provided to build application software to help get products to market faster. The module has a 5-year warranty and is designed for long-term availability, ensuring that it will be available for the lifecycle of developed products. Other offerings include ConnectCore modules based on the i.MX53 and i.MX51 processor families, and the ConnectCard module based on the i.MX28 processor. Scalable and energy-efficient, the ConnectCore family is ideal for a variety of applications. For example, the ConnectCore based on the i.MX53 processor is used to control and stream video wirelessly from the Robonaut, a humanoid robot created by NASA to assist astronauts on the International Space Station. Digi International www.digi.com 46 Electronic Engineering Times Europe March 2014 www.electronics-eetimes.com


EETE MAR 2014
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