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250°C silicon capacitor lines take 11V to 450V 3D silicon passive components provider IPDiA has launched the ETSC (200°C) and EXSC (250°C) silicon capacitor ranges to expand its product offering to higher voltage MCM applications. In modern high temperature electronics, where equipment is becoming extremely expensive and where cost of operation is a key driver, everyone is looking for a “must not fail” capacitor, offering high reliability (no early failures, low FIT) and a long operating lifetime, even at 250°C. To cope with the increasing lifetime requirements, MLCC technologies involve very high de-ratings, leaving no room for miniaturization. Furthermore, these large devices generate extra failures due to ceramic cracks during assembly (unpredictable early failures). Compared with MLCC, IPDiA MOS technology offers a fully modelled reliability model, which makes the reliability predictable during the lifetime of the application. For example, when best in class MLCC offers max 1000 hours at 250°C, IPDiA Xtreme capacitor range can offer up to 84 000 hours under the same conditions. Furthermore, electrical tests at end of production avoid all early failures, hence offering a unique reliability capacitor throughout the lifetime of the application at high temperature. The IPDiA Xtreme temperature 3D structure offers a unique density of 250 nF/mm², with values from 10pF up to 4.7μF. IPDiA 250°C SiCaps can achieve 100 nF in a 0402 package, when 10x10 nF capacitors in 0603 mounted in parallel are required with a Type I dielectric such as NPO. IPDiA www.ipdia.com OmniVision shrinks image sensor pixel to 1-micron The OV16880 is a 16-megapixel CMOS image sensor from OmniVision Technologies Inc. with a pixel size of 1-micron. The sensor uses PureCel-S stacked die technology and supports phase detection autofocus (PDAP). The OV16880 captures 4672 by 3504 resolution images at 30 frames per second (FPS), thus allowing burst photography and zero shutter lag at full resolution. Additionally, the sensor is capable of capturing 4K video at 30 FPS, 1080p video at 90 FPS, and 720p video at 120 FPS. The OV16880 supports interlaced high dynamic range (iHDR) timing functionality to further ensure high quality image and video capture under varying lighting conditions. The OV16880 fits into a 8.5mm by 8.5mm module with a z-height of less than 5mm. The sensor is currently available for sampling, and is expected to enter volume production in 3Q15. “Industry observers expect the 1/3-inch image sensor market for 13-megapixel to 16-megapixel resolution segments to double within the next two years, driven mostly by the proliferation of higher resolution mainstream smartphones and tablets,” said Kalai Chinnaveerappan, senior product marketing manager at OmniVision, in a statement. “The OV16880 is the industry’s first 1/3-inch 16-megapixel image sensor, putting it in the forefront of this high-growth market segment. The sensor enables slim devices to transition from a 13-megapixel to 16-megapixel camera while maintaining excellent image quality and pixel performance.” OmniVision www.ovt.com Altera Ships 20nm SoCs Altera Corporation is now shipping its second-generation SoC family, the Arria 10 SoCs combining ARM processors with a 20nm FPGA fabric. The Arria 10 SoCs are fully software compatible with Altera’s previous 28nm SoC product family for seamless software migration between generations. The SoCs provide up to 50 percent higher performance and up to 40 percent lower power than the company’s previous generation. Altera’s SoC portfolio also includes a 3rd-generation 14 nm Stratix 10 SoC with a 64-bit quad-core ARM Cortex-A53 processor for embedded developers that demand the highest performance and power efficiency. Altera SoC FPGAs enable smarter embedded systems by enabling single-chip product differentiation in both hardware and software. Combining ARM processors with FPGA fabric provides greater system value through reductions in power, costs and board space. Arria 10 SoCs are optimized to deliver the performance, power, security and cost requirements for next-generation embedded applications within wireless infrastructure, wireline communications, computer and storage, and broadcast equipment. Arria 10 SoC samples are currently shipping to select early access customers. Customers can begin their Arria 10 SoC designs by using Quartus II software and the Altera SoC Embedded Design Suite featuring the ARM Development Studio (DS-5™) Altera Edition toolkit. Altera www.altera.com InvenSense upgrades six-axis sensor motion processor Fabless MEMS firm InvenSense Inc. has announced it will soon introduce a six-axis component that combines sensor, digital processor and software for activity classification, gesture detection, pedometer function and run-time calibration. InvenSense (San Jose, Calif.) claimed that the use of its digital motion processor (DMP) and proprietary algorithms results in a power saving of up to 50 percent compared with competition. As a result, with a 300mAH battery, the ICM- 20648 could run a classifier for up to two months and pedometer for up to four months. The InvenSense ICM-20648’s embedded motion hub solution is designed to offload the protocol processing and event filtering necessary to provide “always on” contextual awareness. The ICM-20648 SoC has been designed to meet the Android Compatibility Test Suite (CTS) sensor requirements for power, performance, and timing accuracy in Android 5.0. “Included in the new ICM-20648 is InvenSense’s advanced FSYNC solution, which improves image stabilization, measuring true movement of the camera and enables hardwarebased timing alignment of imaging and motion subsystems to synchronize timing such that motion compensation of the image is more accurate, reducing the software complexity for the OEM, and generating a better imaging experience for the end user,” said Ali Foughi, vice president of marketing and business development at InvenSense, in a statement. InvenSense Inc. www.invensense.com www.electronics-eetimes.com Electronic Engineering Times Europe March 2015 47


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