004_EETE-VF

EETE MAY 2013

may 2013 Identifying the best power supply for your test application Most electrical engineers believe they have a good understanding of power supplies because they are relatively simple, single-function DC devices designed to output controlled voltages. 24 - HAPTICS & USER INTERFACES Critical factors in air-mouse system design Motion control is coming to Smart TVs in the form of in-air mice. MEMS sensors and sensor fusion algorithms provide the foundation for wireless, 3D cursor control, which bring exciting new interaction opportunities to the TV. Opening up new user- interaction scenarios with Time-of-Flight measurements Exploiting depth sensing for 3D interfaces and complex image analysis The quick way to build better embedded user interfaces Time for a new UI programming paradigm 30 32 34 37 40 - ENERGY HARVESTING Energy harvesting wirelessly - the secret to M2M’s success Single-chip solar energy harvester operates wireless mesh nodes At the Energy Harvesting & Storage Europe exhibition that took place around mid-April in Berlin, the organisers IDTechEx have granted Sol Chip Ltd with the “Best Technical Development of Energy Harvesting” award for the single chip energy harvester it demonstrated there. 42 44 Reader offer Win one of five Sabre Lite i.MX6 development board platforms from Freescale, and evaluate the powerful i.MX 6Q multimedia application processor. This month, Freescale and element14 are giving away five such platforms. 46 distribution corner opinion Uncommon Market: Will ASICs be replaced in comms gear? Last Word: Thirty years of DC/DC power technology 4 51 news & TECHNOLOGY Impulse-radio ultra-wide band IC takes the lead on accurate geo-positioning Software defined networks snare open source spotlight Eighteen mainly large communications and software companies have created the Open Daylight Project in the Linux Foundation to develop open source code for softwaredefined networks (SDNs). Germanane beats graphene Organic image sensors sensitive to X-rays, visible and near IR spectrum ranges Novel process could reduce OLED manufacturing costs TSMC starts FinFETs in 2013, tries EUV at 10 nm Facing heated competition from Globalfoundries and Samsung, TSMC pulled in plans for initial production of its 16-nm FinFET process to the end of 2013. Texas Instruments aims to develop a better way to the cloud with HP Project Moonshot New standard tracks soft IP usage through the semiconductor design Smart watches will leverage smartphones adoption to flourish in 2013 Microsoft, Foxconn ink patent licensing deal Microsoft Corp. said it entered into a worldwide patent licensing agreement with Taiwan’s Hon Hai Precision Co., the parent company of electronics contract manufacturer Foxconn. 6 8 9 10 10 12 14 14 16 16 DESI GN & PRODUCTS SPECIAL FOCUS: - POWER COMPONENTS Intelligent diagnostics maximize factory-floor up-times Power factor and solid state lighting – implications, complications and resolutions 17 20 50 3 Electronic Engineering Times Europe May 2013 www.electronics-eetimes.com


EETE MAY 2013
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