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EETE MAY 2013

STMicroelectronics satellite-tracking ICs find fix with GALILEO STMicroelectronics’ Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s own independent navigation system, Galileo. The tests were conducted in collaboration with the European Space Agency (ESA). In March 2013, the first position fix of longitude, latitude and altitude using the four Galileo satellites currently in orbit was performed by the European Space Agency at its Technology Centre in the Netherlands and by ST at its GNSS (Global Navigation Satellite System) software development labs in Naples, Italy. ST and ESA conducted the historic static and dynamic tests using a rooftop antenna with a clear view of the satellites (static) and from a mobile test-bed unit travelling in a normal user environment (dynamic). The Teseo II receiver was able to track and produce a 3D fix over the entire path of the mobile unit, using only the 4 Galileo IOV (In- Orbit Validation) satellites. ST and ESA plan to continue the joint tests, initially as a combined multi-constellation fix with GPS and/or Glonass satellites, then later in the year, when more Galileo satellites are available. STMicroelectronics www.st.com Bluetooth all-in one module with antenna targets automotive use Alps has developed the “UGZZC–G Series” Bluetooth all-inone module with antenna for automotive use, enabling wireless connections between automotive equipment such as car audio systems and mobile devices. Products that use Bluetooth require Bluetooth SIG certification and certification specified in radio legislation in each country. The same certification has to be obtained also for the end equipment after the Bluetooth module has been installed and with the antenna included, meaning an enormous amount of time and effort is spent on examination and testing. Having incorporated the antenna and Bluetooth protocol stack into the module, Alps is responsible for obtaining for the module not only Bluetooth certification but also certification required by radio legislation in relevant countries. The module also has a built-in serial flash memory enabling storage of up to 3,000 phone book data entries and incorporates sorting and other functions for managing that data, thereby helping to reduce the software development workload of equipment manufacturers. ALPS’ addition of a module integrating antenna, Bluetooth protocol stack and memory to its current lineup of All In One modules helps to reduce the design, testing, software development and certification burden for end equipment. The UGZZC–G Series measures 29.0x36.1x8.0mm, operates from a 3.3V supply over the -20 to +75°C temperature range. Alps Electric Europe www.alps.com XMC module supports any platform’s specific I/O or storage needs The Xport5005 from Sarsen Technology is a new XMC module that can be quickly configured to support a platform’s specific I/O or storage needs. By supporting up to three Mini- PCIe cards, the XPort5005 provides a flexible platform for hosting everything from wireless modules (WLAN, cellular, GPS) to communication modules (MIL-STD-1533, CAN, ARINC-429), and anything in between. As the industry’s first XMC to leverage the widely supported Mini PCI Express I/O and mSATA storage module markets, the XPort5005 offers a flexible solution for meeting current and future platform requirements. The module has sites for two Full-Height Mini-PCIe cards and a Half-Height Mini-PCIe card. All three sites support x1 PCIe 2.0 and a USB 2.0 interface for added flexibility. Each site also provides a mini-SIM socket for use with cellular modules. Alternatively, the two Full-Height Mini- PCIe sites can be populated with mSATA modules to meet your solid state storage requirements.The card supports operational temperatures from -40 to +85ºC for conduction cooled applications and -40 to +º70C for forced air cooled applications. Sarsen Technology www.sarsen.net Quad core ARM chip aims at software defined networks in the data center LSI has introduced a 28nm family of communication processors designed to accelerate network performance while supporting increasing traffic loads throughout the enterprise. The Axxia 4500 is LSI’s first ARM technologybased communication processor family designed for enterprise and datacenter networking applications as well as evolving Software Defined Networks (SDN). By combining networking accelerators and Virtual Pipeline technology with ARM’s power-efficient Cortex A15 cores and scalable interconnect, the new Axxia processors are specifically designed to address the performance challenges facing next-generation networks. The networks that carry the data are being tasked to do more than ever before, and the Axxia 4500 communication processor family is purpose-built to deliver the high performance required by these demanding trends. The Axxia 4500 processor family includes LSI field-proven acceleration engines that incorporate decades of communications solutions expertise. The new processors also include up to four ARM Cortex-A15 cores with a CoreLink CCN-504 coherent, QoS aware interconnect in 28nm process technology. The addition of LSI Virtual Pipeline technology allows equipment developers the ability to essentially reconfigure the processors for optimal performance on a packet-by-packet basis. The Axxia 4500 processors also include up to 100Gb/s of L2 switching function to reduce board space and bill of material costs. LSI www.lsi.com 48 Electronic Engineering Times Europe May 2013 www.electronics-eetimes.com


EETE MAY 2013
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