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ANN_ingenieur_91x277_Mise en page 1 18.03.14 13:24 Page1 THE ORIGINAL MEDICAL PUSH-PULL CONNECTOR LEMO SA - Switzerland Phone: (+41 21) 695 16 00 info@lemo.com More than 50'000 connector combinations The modular design of LEMO products provides more than 50'000 different combinations of connectors with a large choice of contact configurations: High and low voltage Coaxial and triaxial Quadrax Thermocouple Fibre optic Fluidic and pneumatic Hybrid Custom solutions Cable assembly Contact your local partner on www.lemo.com optimized. However, combined with a wide range of integrated passive devices (high-density trench capacitors, MIM capacitors, resistors, high-Q inductors) and external active dies, this may represent a very good compromise for cost-driven applications such as in the mobile market. 2.5D silicon interposer: This is also a two vertical stage structure. The difference comes from the copper vias which, combined with IPDs, provide a higher level of integration together with system performance improvements. This structure also allows external component integration on the top and on bottom - see figure 2. 3D interposer: In this case, the structure is a multistage integration and all layers are active. Although the 3D structure could be interesting in terms of miniaturization, it still shows too many drawbacks in terms of design flow, testing, cost, stress impact and thermal issues and will not be addressed in this article. Brief overview of Through Silicon Via technology The use of Through Silicon Vias has a tremendous positive impact on new 3D packaging architectures. TSVs enable higher density and shorter connection lengths compared with wire bonded solutions and are perfectly fitted to face the increasing demand for faster signals and lower power use. IPDiA is providing TSVs for interposers with or without IPDs. In the past years, IPDiA and its main technological partner CEA-Leti have worked on TSV process optimization to bring it to the right level of maturity and cost for markets where high added-value products are needed (medical devices, aerospace, professional electronics and telecom infrastructures). Of the three TSV process options (via first, via middle and via last), IPDiA endorsed the via last approach, in which vias are formed after the die has been manufactured. This choice is mainly driven by co-integrating TSV with IPDiA PICS technology (Passive Integration Connecting Substrate). Moreover, this solution brings the potential of making TSV on pre-existing CMOS wafer or on a 2.5D IPD interposer developed by IPDiA. Fig. 2: Schematic of IPDiA 2.5D interposer with PICS IPD and external active dies in flip-chip or chip-on-silicon technologies. Fig. 3: RF module for medical application using IPDiA 2D interposer technology. www.electronics-eetimes.com Electronic Engineering Times Europe May 2014 33


EETE MAY 2014
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