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Fig. 4: Comparison of module area between standard SMD technology (left) and IPDiA technology PICS (right). Application examples The application examples given below come as a conclusion of this article and illustrate perfectly the benefits of the different types of interposer in three specific areas (implantable medical devices, vision care devices and aerospace). 2D silicon interposer with IPD for implantable medical devices In this first example, major improvements have been brought by IPDiA 2D interposer with Integrated Passive Devices to a medical sensor module including RF communication. The module is to be used in an implantable defibrillation system. The main concerns of the customer are miniaturization (size and weight impacts), stability and reliability. As described in the introduction of this article, the silicon not only serves as a redistribution layer but also allows the integration of passive components within the substrate. It enables a great size reduction (35% area saving, figure 4) and a decrease of the total system weight. Additionally, the PICS technology used for integration of the passive components results in very stable high capacitor integration. Finally, IPDiA offers a complete service with its stable flip-chip technology and the silicon-silicon compatibility between the substrate and the active dies meets the customer’s demand in terms of reliability. 2D silicon interposers with IPD for vision care devices The final application of this second example is linked to the medical field, more precisely to preventive treatment for vision care. The first essential advantage IPDiA has brought forward is miniaturization of the final device in x, y and z axes. But IPDiA has also shown its ability to adapt its technology to the customer’s product environment and has developed a module with four 2D silicon interposers including IPD and active components, the complete system being mounted on a 100 μm thick flexible organic substrate. 2.5D silicon interposer with IPD for aerospace The third example implies integrated passive devices with TSV 2.5D interposer combined with a 3D packaging technology, suitable for motor control in aerospace domain. This time, miniaturization and decrease of the total weight of the device is optimized thanks to the combination of IPD, TSV and 3D packing. Reliability is once again achieved by the silicon-silicon compatibility. IPDiA finalizes the complete module by using a stack die technology on the 2.5D interposer - see figure 5. Fig. 5: 2.5D interposer with PICS IPD and external active dies. INTERCONECTS & CIRCUIT PACKAGING USB driver software reduces power usage FTDI Chip has updated its USB driver portfolio to include a selective suspend feature. The revised drivers have passed Microsoft certification and are available to download free of charge from the FTDI Chip website. Following the launch of lower powered versions of its X-Chip series, the company has now followed this up with enhanced power management in the accompanying driver technology. Supporting many popular Windows environments (with WHQL pass for this feature being achieved in relation to Windows 7, 8, 8.1, Server 2008), the innovative selective suspend feature now incorporated into the FTDI Chip drivers means that the USB host can either enable or suspend a port/peripheral as needed via software control - resulting in far greater flexibility for design engineers when implementing their systems as well as a marked reduction in the overall power consumption. This new capability can be employed for controlling USB ports that are configured together as part of a hub structure, so that it is possible to access particular peripherals or conversely power them down when they are not required to be active. Among the applications where this could prove to be an operational advantage are card readers and biometric scanners on laptop PCs, as well as potential opportunities being envisaged in building automation, environmental monitoring and industrial control systems. FTDI Chip www.ftdichip.com Connector system targets LED-backlit LCD panels Molex’ IllumiMate 1.00 and 1.25 mm pitch wire-to-board connector system provides design flexibility with multiple mating and voltage configurations. IllumiMate 1.00 and 1.25 mm pitch wire-to-board connector system offers display, flat-panel LED television and PC monitor manufacturers more mating styles, voltage ratings, circuit sizes and locking types than any similar connector system, Molex asserts. By providing a single system, the IllumiMate family allows set makers to design various models around a single connector type and PCB footprint pattern. The IllumiMate 1.00 mm saves about 50% of space compared to IllumiMate 1.25 mm and offers lower voltage options to help reduce power consumption. Both the 1.00 and 1.25 mm product families have different options in areas such as voltage, circuit sizes and wire gauge and share several key features including: · Positive and friction locks for secure latching and space savings with an anti wire-tangling feature and middle friction lock with window for visible mating assurance. · Polarisation guide ribs that protect the pins while preventing improper mating and side-to-side movement. The 1.00 mm pitch version has guide ribs located on the housing ends, while the1.25 mm pitch version has them towards the middle. Molex www.molex.com 34 Electronic Engineering Times Europe May 2014 www.electronics-eetimes.com


EETE MAY 2014
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