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EETE MAY 2014

Development kit enables advanced driver assistance systems Texas Instruments’ Vision Software Development Kit (SDK) gives developers a framework, comprehensive set of hardware device drivers and a useful set of development tools for more efficient implementations of advanced driver assistance systems (ADAS) on TI’s heterogeneous architecture. The TI Vision SDK, based on TI’s SYS/BIOS RTOS, enables multiple algorithms to run concurrently on numerous heterogeneous cores and eases integration of new functionality into a system. Debug and instrumentation features allow algorithm developers to benchmark and profile their algorithms in a system context. TI is also making libraries available for both its Embedded Vision Engine (EVE) and digital signal processor (DSP) on the TDA2x System-on-Chip (SoC). The libraries include more than 200 optimised functions for both EVE and DSP libraries, providing building blocks to jump-start development. The EVE and DSP libraries are available for low-to-mid and high-level vision processing. The TDA2x, incorporating Vision AccelerationPac, combines an optimal mix of high performance, vision analytics, video, graphics and general purpose processing cores in a low-power envelope. TI www.ti.com Remote power drivers improve LED lighting system flexibility LumaStream has expanded the company’s Trinity range of remote power drivers for LED lighting, adding an analog model with as many control zones as power channels to give lighting designers and system integrators ultimate design flexibility. Lighting applications where 0-10 V controls are most common, but where only small numbers of LED fixtures are grouped together on one switch, can now have the same variety of lighting configurations as a digital, low-voltage system at the lower analog system price point. LumaStream claims to be the only company to offer a holistic approach to low-voltage power distribution for LED lighting. The Trinity 3-in-1 platform combines digital power conversion, constant current drivers, and superior dimming control into one cohesive, intelligent LED power supply. Trinity remote drivers can power and control up to 24 LED luminaires up to 200 ft. away using only thin-gauge speaker wire. Onboard drivers are often regraded as the number one source of failure in LED fixtures. LumaStream eliminates that failure point, combines power and control onto one wire, and provides both analog and digital control protocols. The Trinity Analog model is ideally suited for hospitality and medical office applications where standard analog control switches and dimmers are used and where individual rooms or spaces may have only one or two LED fixtures that need to be powered or dimmed at once. Both markets, hospitality and healthcare, are experiencing growth in 2014, leading in new construction numbers. LumaStream www.lumastream.com Medical DC-DC converter takes 4:1 input range Murata Power Solutions’s NCM6 series of isolated 6-W single and dual output DC/DC converters accept an ultra-wide 4:1 input range, in three nominal input voltage ranges of either 5 VDC input (4.5 – 9 VDC 2:1 range), 12 VDC (9 – 36 VDC 4:1 range) or 48 VDC (18 – 75 VDC 4:1 range). Each nominal input voltage variant offers seven output voltage models. Four of these are single output versions with +3.3, +5, +12 or +15 VDC output. Three dual output models provide +5, +12 or +15 VDC output options. Recognition of certification to international safety standards UL60950 for IT equipment and 3rd edition medical safety standard UL60601 for 2 MOOP is pending. The DC/DC converters are encapsulated in order to achieve high levels of thermal performance and are housed in a standard package measuring 20.0x32.0x10.75 mm. The operating temperature range is from – 40 to +85 degrees C and the device is protected against damage due to excess operating temperatures. An input undervoltage lockout feature protects the output should the input voltage fall below specified limits. Input to output isolation is 5200 VDC. Murata Europe www.murata.eu 20-nm FPGAs meet interconnect needs with fine-pitch copper bump technology Altera and TSMC have announced that they are to use TSMC’s fine-pitch copper bump-based packaging technology for Altera’s 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance. “TSMC has provided a very advanced and robust integrated package solution for our Arria 10 devices, the highestdensity monolithic 20 nm FPGA die in the industry,” said Bill Mazotti, vice president of worldwide operations and engineering at Altera, adding that it, “... helps us address the packaging challenges at the 20 nm node.” TSMC’s flip chip BGA package technology provides Arria 10 devices with better quality and reliability than standard copper bumping solutions through the use of fine-pitch copper bumps. The technology is able to accommodate very high bump counts as required by high-performance FPGA products. It also provides excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK (Extra Low-K) layers, all highly critical features for products employing advanced silicon technologies. Altera www.altera.com 40 Electronic Engineering Times Europe May 2014 www.electronics-eetimes.com


EETE MAY 2014
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