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Test & Measurement Interaction between OUI and MATLAB The OUI takes information about the signal provided by the user together with acquisition data from the oscilloscope and passes them to the MATLAB workspace as shown. A series of MATLAB scripts are then called to process the data and produce the resulting field variables. The OUI then retrieves these variables and plots them. Automated tests can be ac¬complished by connecting to the OUI or by connecting directly to the MATLAB workspace. At each step the best algorithms are chosen for the specified data type, requiring no user intervention unless desired. Complex modulation formats used in the latest 100G and 400G communication technologies present new challenges for the designer when it comes to choices of test equipment. Certain performance parameters have an obvious impact on the measured signal quality while others may not be immediately apparent. Multipurpose module captures IC failure Cascade Microtech has launched a new Multipurpose Electromigration (MPEM) module featuring an intuitive, fullfeatured test suite for predicting the lifetime and reliability of copper interconnects in modern integrated circuits. Forwardlooking research indicates a fresh approach is needed for evaluating the reliability of copper lines and vias in advanced semiconductor processes. New test techniques, such as constant voltage EM (CVEM), show great promise in complementing the traditional method of constant current EM (CIEM) stress. With MPEM, Cascade Microtech now provides the first commercial EM test to support this intriguing new CVEM evaluation method. The new MPEM module provides multiple stress bias types for testing copper interconnects, typically with geometries of 32 nm or less. With MPEM, the company added constant voltage electromigration (CVEM) and low frequency pulsed current electromigration (LFPEM) applications to its existing lineup of constant current electromigration (CIEM) and stress migration capabilities. Offering versatility by providing three types of EM tests in one convenient platform, customers can compare multiple test methods. Additionally, the MPEM module effectively leverages the traditional advantage of Cascade Microtech’s EM solutions: a fully parallel, high-speed measurement system that is uniquely capable of capturing momentary, self-healing voids. The system offers a broad measurement range, with set points as low as 10uA or 10 mV. Cascade Microtech www.cascademicrotech.com Test adapter addresses SMARC computer-on-modules Yamaichi Electronics has developed a test adapter for the Smart Mobility ARChitecture (SMARC) computer-on-module standard that ensures a perfect alignment of the contacts and allows for 100% contacting reliability up to 50k mechanical cycles. Using spring probe pins, the adapter supports very high contact cycles. It is volume test ready and reduces the cost per tested module. Operation is easy and secure. This test adapter within Yamaichi Electronics ́ YED900 test adapter series can be used for the evaluation of bench tests and for reliability testing from -50°C up to +150°C. The socket is designed with compression mount technology (CMT), requiring no soldering and making it “plug and play”. For contacting the module pads, a conical type plunger tip is commonly used. By using such a tip it can be assured that only a very small witness mark is formed on the module contact pad. The fine-pitch pins are available for pitches starting from 0.3mm. Kelvin type pins are also available. Yamaichi Electronics www.yamaichi.eu I/O module enhances testability of assemblies GOEPEL electronics has added the SFX-5296LX module to its JTAG/Boundary Scan hardware platform SCANFLEX, a mixed signal I/O unit that turns even non-scannable partitions testable through boundary scan. The SFX- 5296LX is equipped with diverse dynamic test resources for each channel, such as a frequency counter, an event detector, an arbitrary waveform generator and a digitizer. With a total of 96 single ended channels the Boundary Scan test can be extended to non-scannable components such as connectors, clusters or analog interfaces. To increase flexibility, each channel can be configured as input, output and tri-state and can be easily programmed using many available parameters. These include switchable pull up/ pull down or selectable slope steepness for the driver. The SFX-5296LX uses the parallel I/O bus and therefore enables much faster data transfer than with serial, via TAP driven I/O modules. Based on the test resources available per channel, both static and dynamic at-speed tests are feasible, allowing a significant improvement of the structural fault coverage along with more flexible test strategies. Thereby only one SFX slot is needed. To increase the number of channels, several modules can be operated simultaneously. The module is based on the ASIC CION-LX, a multifunctional mixed signal tester on chip (ToC) developed by GOEPEL electronics. GOEPEL electronics www.goepel.com 32 Electronic Engineering Times Europe May 2015 www.electronics-eetimes.com


EETE MAY 2015
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