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EETE MAY 2015

Reader O f f er Real-time video analysis at the tip of your lens In this month’s reader offer, Analog Devices is giving away five Blackfin Low-Power Imaging Platform (BLIP) Development Systems (ADZS-BF707- BLIP2), worth 199 dollars each, for EETimes Europe’s readers to win. Targeting demanding ultra-low-power, real-time applications for image sensing and advanced audio, the development platform leverages the company’s ADSPBF707BBCZ 4 Blackfin processor as well as ADI’s optimized software libraries for video occupancy sensing. Measuring 63.5x89mm and drawing under 1W from a 3.2 to 15V supply voltage, the board comes preloaded with an occupancy software module optimized to detect the presence and behaviour of humans or vehicles within indoor and outdoor environments, including for people counting and face detection use cases. An intuitive configuration GUI enables real-time analysis of captured video, as well as video output/display through an on-board USB port. Major elements on the board include the ADSP-BF707BBCZ-4 Blackfin processor with more than 1-Mbyte of internal SRAM and LPDDR, Omnivision’s OVM7692 VGA SoC sensor with an integrated lens, 256MB of DRAM and 32MB of Flash, as well as power management ICs. The USB powered platform comes complete with ICE- 1000 and CrossCore Embedded Studio development tools. Check the reader offer online at www.electronics-eetimes.com Ruggedized tire pressure sensor raises bar Tire pressure monitoring is now mandated by the governments of many countries around the world, making passenger cars and light trucks the biggest market for microelectromechanical systems (MEMS) that go inside the tire to monitor pressure and transmit it wirelessly to the dashboard of the driver. Freescale says it already has the world’s smallest MEMS tire pressure monitor for consumer vehicles, but now its upping the ante by offering the world’s highest pressure sensor for heavy trucks, buses and construction vehicles. Many tire pressure monitors use bulk machining of silicon blocks to realize tire pressure MEMS monitors, but Freescale uses standard inexpensive surface machining to realize a tire pressure monitor that uses capacitance to be much more accurate than the bulk-machined or even other surface machines tire pressure sensors, according to Freescale. Its system-in-package (SiP) also contains a two-axis accelerometer, an S08 8-bit processor with 512 bytes of RAM, 16-kbytes of flash (8k for Freescale library, 8k for applications), dedicated state machines for reduced power consumption, six general-purpose input/output (GPIO) ports — including two analog-to-digital (A/D) inputs — a low-frequency (125-kHz) receiver for programming user-defined functions and making periodic resets, and a high-frequency (315-to-434 MHz) RF transmitter supporting rolling encryption to issue warnings to the fleet manager and to read out a “prognosis” of each tire’s condition. The built-in accelerometer turns off the device when the vehicle is sitting still, but can also record the acceleration while in motion and also includes a temperature sensor to include in the correlations. Freescale www.freescale.com AMC module packs dual DAC at 5.7 GSPS with Virtex-7 FPGA Designed for RADAR signal processing and jamming applications, VadaTech’s AMC529 combines the functionality of the company’s FPGA Carriers and digitizing FMCs. Providing excellent dynamic performance, the board has dual Digital to Analog Converters (DAC) that are 14-bit at 2.85 GSPS (5.7 GSPS in mix-mode). The AMC529 includes a clock jitter cleaner and onboard clock generation. The on-board Virtex-7 FPGA has 3 banks of 144 Mbit QDR-II memory that is 36-bit wide plus 1 Gbit of 16-bit DDR3 memory. The board includes an IPMI controller, and clock holdover stability is also standard on the AMC529 with XO and TCXO crystal oscillator options. VadaTech www.VadaTech.com Power multiplexer ICs for mobile devices Toshiba Electronics has added three power multiplexer ICs that are capable of switching between two different power sources, for mobile device charging applications. The TCK32xG series features small package size with improved protection features for power supplies. TCK321G, TCK322G and TCK323G are intended for applications in the charging circuits of mobile devices that use dual-input power supply systems, consisting of AC adapters, USB or wireless charging inputs. Power source selection is possible through the ICs external signal control and through a built-in auto selection mode function which switches sources automatically according to priorities programmed in advance. Making use of a reverse blocking circuit and thermal shutdown, these new ICs have built in protection features. Additional protection is offered by the integrated over voltage lockout (OVLO) feature with OVLO presets between 12 and 15V for the different devices. All three ICs are contained in a WCSP type package, measuring 1.9 x 1.9 mm, with 0.5 mm pitch, featuring a maximum output current of 2A and a maximum input voltage of 36V. Toshiba www.toshiba.semicon-storage.com 46 Electronic Engineering Times Europe May 2015 www.electronics-eetimes.com


EETE MAY 2015
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