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EETE NOVEMBER 2012

FPGA SolutionS DESIGN & PRODUCTSfrom Mars ZX3 SoC Module Also in the industrial segment new regulations are coming up: PFC is be- ing introduced in portable ƒ Xilinx Zynq™-7000 All Programmable SoC (Dual ARM Cortex™-A9 + Xilinx Artix®-7 FPGA) welders in the Chinese ƒ DDR3 SDRAM + NAND Flash market to improve the ƒ Gigabit Ethernet + USB 2.0 OTG ƒ SO-DIMM form factor (68 x 30 mm) grid quality. In these ap- plications high switching frequency of the AC/DC stage allows to reduce the Mercury KX1 FPGA Module size of the output filters and hence the weight of the machine. Reducing switching losses for the IGBT allows lowering the operating temperature of the device, translating in ƒ Xilinx Kintex®-7 FPGA longer lifetime for these ƒ USB 3.0, PCIe 2.0 + 2 Gigabit Ethernet ports Fig. 2: Current and Voltage waveforms during turn-off: H5 andsystems operating inHigh-performance DDR3 SDRAMƒ ƒ Smaller than a credit card (72 x 54 mm) harsh environments. F5 vs previous generation H3. The above general trends call for new switch the technology are required to address specific requirements of technologies offering an each application. overall reduction of power We speak FPGA. losses (W/mm2), still keep- To address these needs, Infineon has developed a new tech- ing the same or lower chip nology platform called TrenchStop 5 featuring a special cell de- www.enclustra.com cost/mm2. At the same sign and ultrathin wafer technology to achieve low conduction time different flavors of and low switching losses, simultaneously. The fast switching version “HighSpeed 5” is currently being released to address fast switching applications like PFC or boost stages as well as contact@absopulse.ch inverter stages in solar and UPS, DC-DC converters in welding. Figure 1 offers a comparison with previous IGBT generations. www.absopulse.ch Additional technology variants are currently in development, such as an “R” version for resonant topologies to be found in inductive cooking and a low Vcesat “L” version to be used High-Performance, high reliable Power Supplies mainly as polarity switch in solar inverters. 15 W to 12 kW+ adapted to your challenging projects The HighSpeed 5 is offered in 2 versions to offer additional l AC/DC Power Supplies flexibility to the end-user: -HighSpeed 5 – H: “plug&play” replacement of previ• l Rectifiers and Battery Chargers ous generation HighSpeed 3. It results in a drastic performance l DC/DC Converters improvement and doesn’t require any special precaution in l Sine-Wave Inverters design-in. l Phase and Frequency Converters • HighSpeed 5 – F: it provides additional loss reduction, however needs a split Rgon and Rgoff driving stage. It is a best l AC- Input, DC-output UPS systems fit for design with low stray inductance in the commutation loop l Open Frame and in combination with SiC Schottly diode, for example as l Wall mount boost Diode in active PFC. l 19” Cassettes l DC-input dimmable back-light inverters The different switching behavior of H and F version is illus- trated in figure 2, capturing the turn-off event during application for LCD displays test on an internally developed 2 kW H4 Bridge topology: l Complete Power Systems in 19" and 23" Racks The H5 provides a faster voltage rise than H3, resulting in lower turn-off losses. The current waveform is however very ABSOPULSE Marketing Europe GmbH similar to the H3. The apparent oscillation of the tail current PoBox 1501 are amplified by the time scale used (20ns / div). The F5 on 8620 Wetzikon CH the other hand provides shorter tf and faster current fall dI/dt. Tel. +41 78 896 50 49 This translates in additional loss reduction, but also in addi- tional voltage overshoot Ls dI/dt beyond the DC link voltage. In Fax +41 44 944 38 44 this case 900A/us provides almost 100V of voltage overshoot, Write us: contact@absopulse.ch the voltage spike within a more reasonable ~50V, stray induc-meaning approx 110 nH of stray inductance. In order to keep See us: www.absopulse.ch tance of the PCB tracks should be limited to 30~50 nH. A mul- tilayer PCB is preferred, as well as Surface Mounted SMD dis- 50 Electronic Engineering TimesEurope November 2012 www.electronics-eetimes.com


EETE NOVEMBER 2012
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