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EETE NOVEMBER 2012

electronica 2012 Company Profile     High Density 3D Microelectronics Founded more than 15 years ago in France, 3D PLUS is a world leading supplier of high density 3D microelectronic products and On August 2012, 8th, the first car sized rover “Curiosity” built by Die and Wafer Level stacking technology meeting the demand for NASA/JPL landed on Mars thanks to 3-D electronic devices high reliability, high performance and very small size of today’s designed and built in Europe by 3D PLUS. Recognized for their and tomorrow’s electronics. By enabling the stacking of high density, high speed, high reliability and Radiation heterogeneous active and passive semiconductor devices in one Tolerance and their smallest form factors, our space qualified 3- single highly miniaturized package, its 3-D System-In-Packages D memory stacks were selected for this critical mission. (SiP) achieve a combination that cannot be realized with monolithic SoCs. On Ground, as the board form factor decreases and as complexity of system-on-chip (SoC) semiconductor devices The 3-D stacked electronics concept grows, designers are using more and more 3-D electronics that allow standard die to be stacked on top of one another. Its standard products allow gaining a factor of 10 on size and Available in extended temperature ranges and enabling today weight of the components comparing to other existing solutions, the next generation of memory density, our high density - wide and with a capability of stacking up to 10 semiconductor devices data bus (72-bit) DDR2 SDRAM and DDR3 SDRAM memories, within 1mm, 3D Plus Ultra Low Profile Modules are unique. and NAND FLASH micro Solid State Drives (μSSD) help pushing the performance of PC104 industrial computer boards. Although very distant, these applications have the same needs: - Miniaturization (smaller physical systems), - Increased Electrical performance (speed, low power), - High reliability even under harsh environments. With manufacturing plant in France and Taiwan, 3D PLUS products meet the requirements of the most demanding applications in the industrial, computing/telecom., security and defense, avionics, medical and space markets. 3D PLUS 408, rue Hélène Boucher 78532 BUC France 3D Plus Ultra Low Profile Modules Phone: +33 130 832 654 Gain a factor of 10 on size and weight in your electronics Contact: sales@3d-plus.com Internet: www.3d-plus.com   12 electronica 2012 Show Guide www.electronics-eetimes.com


EETE NOVEMBER 2012
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