Page 63

EETE NOV 2014

HIGH SPEED INTERCONNECT DESIGN SEMINARS FREE 20 Minute Sessions - Reservations Not Required Question & Answer Session After Each Seminar PCB MATERIAL SELECTION FOR HIGH SPEED DESIGN This seminar will discuss different types of laminate systems that can be chosen for various design applications. We will emphasize the predictability of losses, the use of various types of copper foil treatments, and the impact of fi berglass weave. Tuesday 11 Nov 2014 10:30 Wednesday 12 Nov 2014 13:30 For more information, or for a free personalized admission voucher germany@samtec.com. Thursday 13 Nov 2014 15:30 CONNECTOR FIGURES OF MERIT This seminar will discuss relative fi gures of merits for connectors and how to use them in selecting a connector for a particular design. Emphasis will be on data available online from Samtec. Tuesday 11 Nov 2014 13:30 Wednesday 12 Nov 2014 15:30 Thursday 13 Nov 2014 10:30 HIGH FIDELITY SIGNAL INTEGRITY MODELING This seminar will discuss the need for precise signal integrity modeling for high performance systems. This will include a discussion on making accurate measurements, material properties, benchmarking of electromagnetic solvers to measurements, and statistical analysis. Tuesday 11 Nov 2014 15:30 Wednesday 12 Nov 2014 10:30 Thursday 13 Nov 2014 13:30 Hall B4, Booth 407 fififififi fifififififi to Electronica, contact us at


EETE NOV 2014
To see the actual publication please follow the link above