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EETE NOV 2014

  electronica 2014 Company Profile   High Density 3D Microelectronics On August 2014, after a journey in Space of more than 10 years, the Rosetta spacecraft built by the European Space Agency completed a Comete Rendez-vous and is now preparing for landing thanks to 3-D electronic devices designed and built in Europe by 3D PLUS. Recognized for their high density, high speed, high reliability and Radiation Tolerance and their smallest form factors, our space qualified 3-D memory stacks were selected for this critical mission. On Ground, as the board form factor decreases and as complexity of system-on-chip (SoC) semiconductor devices grows, designers are using more and more 3-D electronics that allow standard die to be stacked on top of one another. Available in extended temperature ranges and enabling today the next generation of memory density, our high density - wide data bus (72-bit) DDR-II SDRAM and DDR3 SDRAM memories, and NAND FLASH micro Solid State Drives (μSSD) help pushing the performance of PC104 industrial computer boards. Although very distant, these applications have the same needs: - High reliability even under harsh environments.   - Miniaturization (smaller physical systems), - Increased Electrical performance (speed, low power), Founded more than 15 years ago in France, 3D PLUS is a world leading supplier of high density 3D microelectronic products and Die and Wafer Level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. By enabling the stacking of heterogeneous active and passive semiconductor devices in one single highly miniaturized package, its 3-D System-In-Packages (SiP) achieve a combination that cannot be realized with monolithic SoCs and a high yield that cannot be reached with semiconductor’s TSV approach. Its standard products allow gaining a factor of 10 on size and weight of the components comparing to other existing solutions, and with a capability of stacking up to 10 semiconductor devices within 1mm, 3D Plus Ultra Low Profile Modules are unique. 12 electronica 2014 Show Guide www.electronics-eetimes.com With design and manufacturing plant in France, 3D PLUS products meet the requirements of the most demanding applications in the industrial, computing/telecommunications, security and defense, avionics, medical and space markets. 3D PLUS 408, rue Hélène Boucher 78532 BUC France Phone: +33 130 832 654 Contact: sales@3d-plus.com Internet: www.3d-plus.com 19 x 19 x 3.9 mm All-in-One Computer Module The 3-D stacked electronics concept


EETE NOV 2014
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