Page 9

EETE NOV 2014

New 2 mm Pitch Discrete Wire, IDC System This 2 mm pitch discrete wire IDC system (see Figure 3) is designed for a high reliability connection and ease of discrete wire termination in field applications. Available as IDC components only, this system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts, etc. The wire is terminated with standard flat jaw pliers. The discrete wire IDC system includes a cable socket (I2SS Series), and a mating board level header (T2I Series). The cable component Figure 3. Ideal for field applications, this new 2 mm system is designed for high reliability connection and ease of termination. is available in 2, 3, 4 or 5 positions and accepts 24 AWG discrete wire cables. The board level connector is a single row configuration with through-hole termination for increased stability on the board. In addition, a single end latching system is standard for secure locking. This system is ideal for industrial applications including installation, testing and maintenance in the field due to the fact that no special tooling is required for assembly. Sealed, High Density IP67 Mini Push-Pull System Figure 4. Samtec’s new AccliMate™ Mini Push-Pull system features lightweight plastic construction and a small form factor for increased density on the panel. Samtec’s new AccliMate™ sealed mini push-pull system (see Figure 4) is IP67 protected against dust and water, making it ideal for harsh environments and high density applications. The system is constructed of lightweight plastic and designed with a small form factor for increased density on the panel. These are available as the MCP8 and MCR8 Series. This sealed cable system is intermateable with the Hirose HR30 Series, allowing for ease of integration into existing systems. The cable-to-cable or cable-to-panel solution is available in 12 positions with 28 AWG cable in standard lengths of 0,25 On The Cover Samtec combines advanced IC Packaging and Ultra Micro interposer technologies to achieve optimized interconnect paths, from the bare die to an interface 100 meters away, and all insertion points in between. To learn more about advanced packaging and micro interposers, go to www.samtecmicroelectronics.com. meter and 0,50 meter. A simple pull lock/release system creates a secure lock and allows for quick disconnection. Molded grooves prevent hand slippage and polarizing keys protect from misalignment. This system is available as complete assemblies or components in a Field Termination Kit, with hand tools or mini applicators also available. Samtec At A Glance • $610 million U.S. estimated sales, 2014 • ISO 14001, 9001, and TS 16949 certified • RoHS, REACH, IMDS, ITAR compliant • Global footprint: Americas, Asia Pacific, Europe, Middle East, South America • Recognized Service Leader • Products include high speed board level interconnects, high speed cable assemblies, optical systems, IC packaging and microelectronics expertise, the industry’s largest variety of board-to-board interconnects, rugged and power systems, micro rugged interconnects, and sealed products www.electronics-eetimes.com Electronic Engineering Times Europe November 2014 9


EETE NOV 2014
To see the actual publication please follow the link above