Page 46

EETE NOV 2015

Reader O f f er Give-away: 32-bit MCU board plus compiler kits This month, FTDI Chip is giving away six MCU development board packages complete with a dedicated compiler (including a full integrated development environment). Worth Euro 315 each, the packages include a credit card sized Clicker 2 board for the FT90X 32-bit MCU supplied alongside a powerful dedicated compiler from MikroElektronika. This MCU delivers zero wait state operation at speeds of 100MHz by using its 256kByte built-in shadow RAM. Alongside the MCU, the board has all the additional components requited for embarking upon an embedded system development project. These include LED indicators, crystal oscillators and configurable pushbuttons, as well as a power management/battery charging subsystem. Through IDC10 connectors, the Clicker 2 can link up with an array add-on boards covering various tasks - imaging, wireless communication, motion control and suchlike. With regard to the accompanying compilers, each of these provides a full integrated development environment (IDE) with added library support for all FT90X features plus syntax colour-coded editor and project manager windows. Competition winners can choose from 3 different programming languages. These are C, Pascal and Basic. FTDI Chip - www.ftdichip.com Check the reader offer online at www.electronics-eetimes.com OmniVision offers iris-recognition sensor OmniVision Technologies Inc. (Santa Clara, Calif.) has announced a 1920 by 1920 pixel image sensor that is also optimized for infrared light sensitivity allowing it to serve as an iris-recognition sensor. The OV2281 has 1.12-micron pixels can record 1080p high-definition video at 60 frames per second in both portrait and landscape orientation, thus supporting iris detection in either situation. When recording full-resolution 1920 x 1920 video at 30 FPS, the sensor requires 126mW. It also supports a low power mode that can reduce power consumption to approximately 25mW. As a monochrome sensor, the OV2281 produces images in low-light conditions. “Industry experts project that 13 billion biometric applications will be downloaded by 2.2 billion mobile users between 2014 and 2020,” said Archie de Guzman, staff product manager at OmniVision. “In this context, iris detection appears poised to become the next trend in biometric security for mobile devices. The OV2281 therefore enters the market as an extremely compelling solution by offering accurate horizontal or vertical iris detection in a compact and power-efficient package.” The sensor fits into a 5.5mm by 5.5mm module with a z-height of less than 4.5mm and is in volume production. OmniVision Technologies Inc. www.ovt.com In-mold electronic inks enable seamless functional integration DuPont Microcircuit Materials is launching a suite of in-mold electronic inks designed to help streamline electronic devices by reducing the need for rigid circuit boards. By printing circuits directly onto plastic substrates, touch controls, such as electronic buttons, switches and slides, are readily integrated in applications such as home appliances and automobiles. The inks offer important design, manufacturing, weight and cost advantages and mark the further expansion of DuPont advanced materials enabling printed electronics. The DuPont ME series in-mold electronic inks are designed to withstand demanding manufacturing processes such as thermoforming and injection molding. They also simplify the assembly process because there is only a single connection point and no wires behind the console. This can reduce the weight of a console by more than 70 percent. In addition to increased design freedom and lighter weight, the technology can reduce cost by up to 50 percent compared to currently available buttons and up to 20 percent versus other electronic touch switch systems. DuPont Microcircuit Materials http://mcm.dupont.com Power management IC eases hearing aids design ON Semiconductor’s HPM10 Power Management Integrated Circuit (PMIC) and Ezairo 7150 SL wireless-enabled audio processor are aimed at the hearing aids market. The Ezairo 7150 SL uses the company’s widely-implemented proprietary DSP technology and brings wireless connectivity to hearing aids and cochlear implants. The compact hybrid module is based on the Ezairo 7100 open-programmable 24 bit mixed-signal DSP platform, offering a System in Package (SiP) solution supporting wireless multi-protocol operation and optimized for 2.4GHz band applications, including Bluetooth Low-Energy. Ezairo 7150 SL integrates EA2M, a low power 2 Mb serial CMOS EEPROM used for storing hearing aid firmware and important parameters. The HPM10 chip generates the voltage needed by the hearing aid and it also manages the charging algorithms such that the battery autonomy and the number of charging cycles are optimized. The rechargeable chemistries supported include silver−zinc (AgZn), and lithium−ion (Li−ion). HPM10 also detects zinc−air (Zn−Air) and nickel metal hydride (Ni- Mh) batteries but doesn’t charge them. During operation, HPM10’s high efficiency power regulators help minimize lost power from the battery to the hearing aid. HPM10’s built-in charger communication interface (CCIF) can pass data to the hearing aid charger during the charging process. Different charging parameters, representative of battery size and type, can be stored in the HPM10’s on-chip one-time programmable (OTP) memory. ON Semiconductor www.onsemi.com 46 Electronic Engineering Times Europe November 2015 www.electronics-eetimes.com


EETE NOV 2015
To see the actual publication please follow the link above