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EETE OCT 2014

Sensirion extends its sensors’ scope At electronica, Sensirion will be presenting the Platform3x, consisting of a group of humidity and temperature sensors with different precision levels and features. Included in the Platform3x is the SHT3x sensor which the manufacturer says combines the strengths of the established SHT1x, the revolutionary SHT2x and the advanced SHTC1 series in a single, unique product. Measuring 2.5x2.5mm with a height of 0.9mm, the SHT3x includes a user programmable alert function, where the sensor can be used as a humidity and temperature sensor, but also an analog ratiometric voltage output, turning the device into the first fully calibrated and linear digital/analog humidity and temperature sensor. Hence the SHT3x series combines multiple functions and various interfaces (I2C, voltage out) with a user-friendly, very wide operating voltage range (2.4 to 5.5 V). The device is based on the company’s proven CMOSens Technology. Sensirion www.sensirion.com Nanium takes wafer-level packaging to XXL Nanium S.A. has unveiled what the company believes is the industry’s largest Wafer-Level Chip Scale Package (WLCSP), a 25x23mm packaging solution produced in volume on 300mm wafers. Entirely developed in-house for Custom Silicon Solutions (CSS), a California-based provider of complex mixed-signal ASIC solutions, the customized Fan-In Wafer-Level Packaging/ WLCSP solution is nine times larger in area than the industry standard WLCSPs, typically measuring up to 8x8mm. “After completing a very successful high volume run of a 65nm product in eWLB at NANIUM, we approached them with our next 28nm WLCSP requirements. The first article worked as promised and enabled CSS to get to market quickly with an ASIC unprecedented in thermal and computational performance”, said Mike McDaid, Director of Sales at CSS in a statement. “No other package solution in existence would have achieved the low lead resistance and high reliability we demanded. This ASIC in Nanium’s WLCSP establishes a new world class of integration, beyond VLSISOC (Very Large Scale Integration System-on-Chip). The final product is just about the maximum reticle size allowed and consumes hundreds of Watts!” McDaid added. The wafers with the high-performance digital chips are produced with 28nm CMOS technology and contain over 5.5 billion transistors, one of the largest transistor-count chip produced by Global Foundries. Once produced in Dresden, Germany, wafers are sent to Nanium for packaging. The WLCSP solution developed by NANIUM relies on a high count of 1,188 solder balls at a wide BGA pitch of 0.7mm. It has successfully passed more than 400 temperature cycles on board. Nanium www.nanium.com Ceramic bandpass filters target applications from 300 MHz to 10 GHz Available in surface mount or connectorised formats, the AT22D range of ceramic bandpass filters from Aaren Technology Ltd are suited to applications from 300 MHz to 10 GHz. The AT22D filter represents a low frequency design for ceramic technology with the 5 section bandpass design having a centre frequency of 390 MHz and features 6 mm resonators. The pass band is 30 MHz with a rejection of 40 dB at 300 MHz and 480 MHz and the insertion loss is 2.5dB maximum. Ceramic filters are made from high-dielectric constant ceramic resonators plus a capacitive coupling network to realise an “n” section cavity filter. The AT22D features 5 resonators, however the number of resonators can vary from 2 to 8 or more — dependent upon the required filter response. Applications for this particular design could be related to any TETRA radio system requirement. However, given the wide frequency range over which these filters can be designed, applications can include, cellular, PMR, avionics or defence, to name a few. Ceramic filters are less expensive and smaller than either LC or cavity type filters. Typically available with a bandpass response, they are also available in “notch” or band reject configurations. In addition ceramic designs can be configured as duplexers for transmit/ receive applications. Monoblock ceramic filters, formed from a single block of ceramic material are also available. This design of ceramic filter does not have a printed circuit board to secure their elements together, the entire block being surface mounted directly onto the circuit board. Aaren Technology Ltd www.aaren-technology.com Interface connects FlexRay to PC To meet the growing demand for small, portable vehicle bus / PC interfaces capable of operating without separate power supply, ETAS GmbH has developed the ES583 FlexRay USB module. The product complements ETAS’ existing offerings for CAN bus interfaces. The ES583 interface can be used to collect ECU measurement, calibration, and diagnostic data as well as to reprogram an ECU’s flash memory via FlexRay bus. Here, a second internal FlexRay node is responsible for initiating communication with the bus node connected. This makes it possible, for instance, to flash an individual ECU on the lab bench – away from the FlexRay environment the unit is connected to in the vehicle. To ensure that the ES583 module can be easily integrated into software tools provided by thirdparty suppliers, the ETAS EBI-IP ECU and Bus Interfaces Integration Package comes with an open interface. The ES583 is fully integrated with ETAS’ INCA software diagnosis and verifying tool suite. For maximum safety, it offers galvanic isolation of FlexRay interface and PC. Through an open program interface, it can be integrated into existing or future software tools. ETAS GmbH www.etas.com 48 Electronic Engineering Times Europe October 2014 www.electronics-eetimes.com


EETE OCT 2014
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