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in which it could technically allow Qualcomm to take action to protect its IP. Rommel added, “However, they and AllSeen are on record saying they do not plan for this to ever happen.” Richmond called OIC “a young group.” It’s a year old. But he described the group as “technically very ambitious.” While the OIC has maintained a low profile while “senior architects sent from its board member companies literally pounded away at the spec.” Richmond - an Intel employee at that time - was “just a lurker at the OIC meeting until last March,” he said. “But I was blown away” by OIC participants’ intensive work. After the OIC all-member meeting, he decided to take the job as the group’s executive director in May. Richmond, who has lived through various networking technology debates (i.e. token ring vs. Ethernet), said, “It’s so easy to get caught up in a day-to-day marketing battle.” While it’s a “great game,” he cautioned that “IoT is a marathon. We have just reached the first post on a long road.” More specifically, Richmond said, “Our concern is not getting there first, but getting it right.” Otherwise, the industry will pay for its haste five years from now, he warned. Although there are differences in IoT industry specs, Richmond takes the long view. “The industry has its own way of sorting out differences, just like we have seen what happened with the networking technology debates.” Asked about what’s ahead, he acknowledged that many things are still left undone – including the launch of the OIC certification program. The group has already done three plug fests, he said, “which we see as onramp to certification.” He also noted that the OIC has no intention to do “soft certification” – a simple protocol in which companies self-certify their products. Asked how the OIC is planning to define “things” – each connected device’s functions and use cases on the application level, Richmond said, “We have liaison agreements with other industry groups” who have spent years working on definitions. While declining to name the groups the OIC is working with (he said he isn’t sure which ones are public), he explained that lots of detailed work has been done in areas such as industrial, health/fitness and automotive. The OIC has no plans to duplicate their work. Similar to Qualcomm-led AllSeen, OIC is focused on the application layer sitting above the network stack. OIC’s Richmond said, “We run on top of Thread network. We see ourselves a perfect fit.” However, devils lurk in the details. VDC’s Rommel pointed out, “All IoT middleware/framework alliances and consortiums have slightly different points of focus and goals, whether it is on a particular vertical market, proximity radio, or on a slightly different part of the software/system stack.” Rommel summed it up: “Thread, for example, sits below OIC/IoTvity and is focused on an IP specification for low power devices over wide area networks, but does not provide full endto end interoperability. Allseen, like OIC, targets the development of a higher level communication framework but is initially targeted at consumer/ home applications. OIC is intended to ultimately have a broader target across more vertical markets than is Allseen. FOR IMMEDIATE SALE AUCTIONS | LIQUIDATIONS | APPRAISALS LATE MODEL SEMICONDUCTOR & SOLAR PANEL MANUFACTURING EQUIPMENT Assets located in San Diego (USA) & Freiburg (Germany) FEATURED ASSETS: • Frame Welding Fabrication & Assembly (YASKAWA, FANUC) • Factory Transport Systems (FANUC, ASYS) • Plate Attachment Lines (SIEMENS, KUMATIC) • Lens Attachment Lines (COMAU, FRESNELOPTICS) • Substrate Assembly Lines (TRUMPF, SCHAAL) • Wafer Singulation (DISCO, TOKYO) • Solar Cell Package & Assembly Lines (BILCO, TRUMPF, ESEC) • Metrology & Lab Equipment (VOTSCH) • AND MUCH MORE!! CONTACT: Kevin Shows, GES (USA): (480) 610-1604 x11 | Sebastian Geissler, Maynards (GERMANY): +49 8151 9989753 | E-mail: soitec@maynards.com www.electronics-eetimes.com Electronic Engineering Times Europe October 2015 23


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