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Anybus CompactCom 40 industrial protocols on tiny FPGA Microsemi Corporation and HMS Industrial Networks have joined forces to deliver the Anybus CompactCom 40-series products for industrial Ethernet solutions, based on Microsemi’s SmartFusion 2 SoC FPGA device. The highly secure device offers customers lower total cost of ownership and accelerated time-tomarket with low power and secure industrial Ethernet protocol conversion solutions on a single Smart- Fusion2 FPGA platform. HMS’s Anybus CompactCom 40-series products offer hardware solutions specifically designed for factory automation applications including programmable logic controllers (PLCs), motor drives, motion drive control and safety modules, as well as other applications for industrial customers. HMS products are available in chip, brick and module product offerings, allowing customers to avoid designing ASSP/ASICspecific boards for each industrial Ethernet standard. Customers can use HMS’s CompactCom 40-series and program Microsemi’s FPGA to the desired industrial Ethernet protocol standards with the intellectual property and software stack for the ARM Cortex-M3 microcontroller in SmartFusion2. Microsemi www.microsemi.com SuperSpeed USB-to-FIFO bridge ICs easy evaluation To encourage the widespread use of its FT600/1Q USB 3.0 SuperSpeed ICs, FTDI Chip has launched a new family of evaluation/development modules. Measuring 78.7x60mm, the UMFT600A and UMFT601A each have a high speed mezzanine card (HSMC) interface with 16-bit and 32-bit wide FIFO buses respectively. The UMFT600X and UMFT601X measure 70x60mm and incorporate field-programmable mezzanine card (FMC) connectors, again with 16-bit and 32-bit wide FIFO buses respectively. The HSMC interface is compatible with most Altera FPGA reference design boards, while the FMC connector delivers the same functionality in relation to Xilinx boards. Fully compatible with USB 3.0 SuperSpeed (5Gbits/s), USB 2.0 High Speed (480Mbits/s) and USB 2.0 Full Speed (12Mbits/s) data transfer, the UMFT60xx modules support 2 parallel slave FIFO bus protocols with an achievable data burst rate of around 400MBytes/s. The multichannel FIFO mode can handle up to 4 logic channels. It is complemented by the 245 synchronous FIFO mode, which is optimised for more straightforward operation. FTDI Chip www.ftdichip.com Video fusion IP core targets FPGA and SoC systems RFEL has updated its flagship Video Fusion high definition video processing IP core for FPGA and System-on-Chip systems, with sophisticated enhancement and customisable pseudo-colour mapping features to help product designers add a competitive edge to their systems. Fusion as a concept is simple: create a single video of a scene that combines feature information from two cameras, one operating in the visible spectrum and one in the infrared (IR) spectrum. The fused result provides complementary information that can sustain operation in low light, poor weather conditions and in the presence of smoke or other obscurants. To meet the highest Fusion performance, RFEL has taken the multi-resolution approach at the heart of the Video Fusion IP core, and added important enhancements, such as colour noise suppression, important for natural looking results in low-light conditions. Pseudo colour pixel depiction is also new for 2015, and gives designers the ability to highlight key temperature differences in a scene, with fully customisable colours for hot objects in the scene, in preference to the natural contrast grey levels. This can be controlled in realtime, so that users do not have to compromise when their mission changes from situational awareness to surveillance. The IP includes real-time warp capability to pixel-align the slightly different fields of view typical of side-by-side sensors arrangements, which relaxes mechanical design tolerance and maintains accurate results. RFEL www.rfel.com Printable electronic inks cure at only 60ºC DuPont Microcircuit Materials (DuPont) is launching electronic inks that cure quickly at low temperatures, down to 60ºC, expanding the possibility of printing electronics onto an entirely new group of plastic films. The technology is expected to enable electronic components such as sensors, heaters and antennas to be printed on more versatile and less expensive substrates. Historically, electronic inks have required curing temperatures between 100°C and 140°C restricting electronic substrates to those that can survive at high temperatures. The new DuPont PE827 and PE828 low-temperature inks expand substrate choices for new fields of applications using substrates such as PVC, polystyrene, high-density polyethylene, and acrylic polymers, among others. DuPont Microcircuit Materials http://mcm.dupont.com www.electronics-eetimes.com Electronic Engineering Times Europe October 2015 47


EETE OCT 2015
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