042-043_EETE-VF

EETE SEPTEMBER 2012

DESIGN & PRODUCTS 3D development tool aids embedded vision Underfill formula reduces stress and controls National Instruments has added 3D vision capabilities in Lab- warpage for next-generation flip chip devices VIEW to make machine vision applications more accurate. The Addressing the challenges associated with ever-thinner flip Vision Development Module 2012 allows engineers to develop chip die, Henkel has developed a high-performance under- a 3D stereo vision system us- fill: Loctite Eccobond UF 8840 that reduces package stress ing any two cameras and can through controlling perform advanced inspection die and substrate and control that uses depth warpage. Because information from 3D vision the substrate and flip technology. They can also chip die have different use LabVIEW with third-party coefficient of ther- hardware and software tools mal expansion (CTE) for 3D vision and combine 3D characteristics, thermal images with other algorithms, processing (second- such as pattern matching or ary reflow) can lead object tracking, to profile sta- to either upward (“smiling”) or downward (“crying”) package tionary or moving objects. The module includes high-precision warpage which may ultimately result in poor reliability. Loctite 3D image acquisition using new stereo vision and calibration Eccobond UF 8840 offers compatibility with a wide variety of algorithms as well as compatibility with third-party 3D cameras flux systems, has minimum resin bleed out, delivers maxi- that use laser triangulation technology. Integration of additional mum process adaptability through compatibility with both 3D processing and analysis libraries, such as the AQSENSE traditional needle dispensing and non-contact dispensing SAL3D library, in the same graphical programming environment and has a wide dispense process window for manufacturing simplifies the development of machine vision applications from flexibility. The formula flows consistently with no voids on flip optical character recognition on pharmaceutical packaging to chip die up to 15x15mm. Testing in an applications labora- examining solar panels for cracks. tory environment shows reduced warpage – less than 80 µm National Instruments on a 20x20mm flip chip die with a thickness of 730 µ m – and www.ni.com compatibility with a variety of die passivations. Henkel AG & Co. KgaA Smart meter RF coupler provides 10kV www.henkel.com/electronics electrical isolation The RF Savvy Series, patent pending, Nona-band radio Connection system targets Class I, Division 2 frequency (RF) coupler from Alpha Micro Wireless offers 10kV of electrical isolation to enable safe routing of the RF and Zone 2 hazardous locations signal from the Molex introduced the Brad Ultra-Lock (M12) EX Connection network inter- System, providing process automation installers a safe, quick face card (NIC) connection interface for instrumentation and control devices in or wireless potentially explosive and modem to a hazardous areas. As with remote external other Brad Ultra-Lock antenna via a connectors, the Ultra- bulk head RF Lock (M12) EX features connection in patented push-to-lock the meter base. technology, providing Unlike other a simple and secure inefficient RF coupling schemes and isolator solutions on the operator-independent market, the RF Savvy series Nona-band RF Coupler offers connection. In addition, an ultra-low loss (less than 0.5dB at 915MHz), extremely the system includes an integral isolating ring that limits access high electrical isolation and operates universally over nine to the release mechanism of the connector, allowing the con- frequency bands. RF input and output terminations are via nector to be pushed on but requiring a screwdriver to discon- gold plated 50 Ohm MMCX jack connectors for rugged and nect. Because the connection point is considered non-arcing it easy installation. The RF Coupler has been designed with is suitable for use in a Class I, Division 2 and Zone 2 classified a low profile (1.0mm) generic form factor suitable for use areas. The Ultra-Lock (M12) EX includes pre-wired moulded within the enclosure of most residential and commercial/ connections with polarised positioning on the cordset, provid- industrial electric utility meters. The device can be retro-fitted ing more reliable performance in high vibration applications and to most utility meters or tailored for a custom fit to specific reduced wiring termination errors. The radial seal offers IP67 / OEM applications. Automated metering infrastructure (AMI) IP68 / IP69K watertight connections for temporary submersion wireless system integrators and utility meter manufacturers making the connectors ideal for environments such as oil refin- can choose to retro-fit a generic, 45x45x1mm version of this eries, petrochemical complexes, waste water processing plants, low-profile coupler into their SMART metering applications. pharmaceutical manufacturing facilities and food and beverage Apha Micro Wireless processing plants. www.alphamicrowireless.com Molex www.molex.com 42 Electronic Engineering Times Europe September 2012 www.electronics-eetimes.com


EETE SEPTEMBER 2012
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