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Rear-mounted, panel-flush light pipes available in 10 standard lengths VCC Optoelectronics has developed a series of low profile, panel-flush light pipes that are designed to blend in with the panel until they are illuminated and facilitate easy panel removal. Designated the LPCM Series, the light pipes are made of clear, optical grade acrylic for maximum light transmission, and will mate to any PCB using SMD 4. VCC’s new RoHS-compliant light pipes are available in 10 standard lengths spanning 0.3 inches to 1.2 inches; custom lengths are available upon request. VCC Optoelectronics www.vcclite.com Seven-channel relay driver reduces board space by 80 percent for telecommunications applications Texas Instruments Incorporated has introduced what the company claims is the in- dustry’s first fully-integrated, seven-channel relay driver that can support low-voltage relays from as low as 1.8 V up to 5 V. The ULN2003LV relay driver replaces a hand- ful of discrete components with a single device to drive lower voltages for data relays and rails within telecom- munications equipment. Using the ULN2003LV integrated circuit (IC), customers can reduce board space by up to 80 percent, while lowering power consumption and cost. The ULN2003LV offers high performance in noisy environments. The input resistor capacitor (RC) snubber improves the driver performance in noisy operating conditions.The device enables channel grouping for higher current loads. An internal input pull-down resistor allows input logic to be tri-stated for greater efficiency at higher loads. Seven low-output im- pedance drivers minimize on-chip power dissipation, providing five times lower power consumption versus the competition. The relay’s 1.8-V to 5-V CMOS logic input in- terface is compatible with a wider range of microcontrollers and other logic interfaces compared to the competition. Texas Instruments www.ti.com Pre-cut dicing and electrically conductive die attach film all-in-one With Loctite Ablestik CDF 200P, Henkel introduces a precut combination of dicing film and conductive die attach film for 6” or 8” wafers. The Loctite Ablestik C100 in 2010 enables leadframe device manufacturers to take advantage of a die at- tach film which includes consistent, uniform bondlines, eliminating die tilt while incorporating ultra-thin wafers. In addition, because films eliminate the fillet associated with paste-based materials, they allow more die per package due to tighter die to pad clearance. Now, leadframe semi- conductor specialists have the option to use Henkel’s roll format Loctite Ablestik C100 or its new pre-cut, two-in-one (dicing tape and die attach film combination) Loctite Ablestik CDF 200P conductive die attach films, thereby enabling package design scalability not possible with conventional die attach materials. Compatible with lamination equipment commonly used in the field, the new dicing film requires no capital equipment investment. With a lamination temperature of 65 degrees Cel- sius, the novel material complies with most existing equipment andprocesses for both lamination and backgrinding. Additionally, its unique two-in-one dicing tape and die attach film combination streamlines manufacturing by facilitating an in-line process for thin wafers and a single lamination process in one, combined step. The product is proven effective on a wide range of die sizes from 0.2x0.2mm to 5.0x 5.0mm, a variety of wafer metallizations including bare silicon, TiNiAg and Au, and multiple leadframe metallizations such as Cu, Ag and Au. Henkel AG www.henkel.com www.electronics-eetimes.com Electronic Engineering Times Europe September 2012 45


EETE SEPTEMBER 2012
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