027_EETE-VF

EETE SEPT 2013

Single cable for high-speed networking performance and power technology TE Connectivity has released the Cloudsplitter Connector System which is a single cable solution for powered devices that delivers Cat5e performance and up to 250 W of power over a single cable. The system is RoHS/REACH compliant, designed to meet UL444 and utilizes CM rated cable. The solution is suitable for use in video surveillance over IP networks, intelligent building management, factory automation and wireless network transceivers. The Cloudsplitter SMT cable plug combines eight 26AWG stranded signal conductors and two 18AWG stranded power conductors in shielded or unshielded configurations. The SMT jack is backward compatible and accepts a Cloudsplitter plug or a standard RJ 45 shielded plug. The system’s integrated power contacts provide DC power at 5 A and up to 50 VDC. Two LED lights are included in the jack assembly for standard data transmit and receive indication. The Cloudsplitter connector system’s unitized connection approach combines two connections into a single product to provide a power and data solution for devices. TE Connectivity www.te.com High density PXI large-matrix format products Pickering Interfaces has expanded its range of 2-A 1-Pole matrices with releases that include the highest density solutions available in PXI large matrix (BRIC) format. The 40-596, 40-597, and 40-598 are all BRIC 1-pole matrices with 2A current rating, up to 60W hot switch power and 100 VDC/70 VAC voltage rating – depending on the configuration, these products are available in 2-slot, 4-slot, and 8-slot PXI modules. Each model sets new standards in the achievable density of PXI matrices with configurations of 6, 12, and 16 Y Axis connections and maximum X Axis connections of up to 464 (up to 3,072 matrix crosspoints). For the first time matrix sizes have been introduced at Y sizes of 6 and 12 to complement the usual 4, 8 and 16 sizes; giving users further choice of Y axis size and maximising the X axis size for each configuration. User connections are provided by industry standard D-type Connectors and are supported by the comprehensive range of connection solutions also available from Pickering Interfaces. The BRIC product range uses high quality electro-mechanical relays to achieve their 2-A switch rating. The BRIC structure allows the creation of large PXI matrices over multiple slots without the use of expensive external cables. The fully integrated programming Interface represents the matrix as a single entity, easing user programming and reducing the likelihood of user errors. Pickering Interfaces www.pickeringtest.com Modular backplane system increases RF content in board-to-board mating Molex has released a high-performance connector system designed specifically to enable PCB developers to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints. The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility. he modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 Interface allows up to 1.00 mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs. The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3 GHz frequency applications making it suitable for CATV, communication systems and high-density radio applications. The Connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing. Molex www.molex.com Hypertac, Sabritec, IDI unite under Smiths Connectors brand A provider of high performance interconnect solutions, Hypertac has undertaken a comprehensive re-branding initiative that will position the company, along with its two sister companies Sabritec of Irvine, CA and IDI of Kansas City, KS, under the Smiths Connectors banner. Over time, the three distinct and previously independent brands have forged a close-knit working relationship based upon the natural synergies that exist between their respective technologies and business models. The level of cross-selling and interaction between brands has increased to the point where the time has come to make the combined value and power of the three individual brands more visible in the global market place. As such, a single branding architecture has been created that simplifies the relationship among the brands and with the ultimate shareholder, Smiths Group. The logos of Hypertac, Sabritec and IDI technology brands have been redesigned and placed under the unifying logo of Smiths Connectors. The new visual representations appear in all advertising, printed collateral material and on all product documentation. In addition to extending Smiths Connectors’ global presence through the combined brands which provides a far larger suite of interconnect product and service offerings, the re-branding also increases the focus on delivering the most comprehensive solutions available to its worldwide customer base. Listening closely to the voice of the customer and ensuring the highest possible level of customer awareness and sensitivity continues to be a cornerstone of the Smiths Connectors’ business model. Smiths Connectors www.smithsconnectors.com www.electronics-eetimes.com Electronic Engineering Times Europe September 2013 27


EETE SEPT 2013
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