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Vector network analyzer features advanced pulse measurement capabilities Anritsu has expanded its VectorStar family of Vector Network Analyzers (VNAs) with the MS4640B series. The instrument features new measurement capabilities, including PulseView, which provides pulse profile, point-in-pulse and pulse-to-pulse measurements of S-parameters, and DifferentialView for true mode stimulus S-parameter measurements. It is particularly suited to testing and characterizing components and sub-systems designed for Radar and today’s High- Speed serial applications. The 2.5ns resolution with 100 dB dynamic range, coupled with independent measurement gates offer clear results. It also enables users to see performance perturbations on the rising/trailing edges and within a pulse that have been previously missed by other systems. A capture time of 500ms permits users to measure under long pulse repetition interval conditions or to conduct pulse-to-pulse measurements over an extended number of pulses. An additional IF digitizer option provides fast digitization for the PulseView application, as well as four internal pulse generators. The pulse generators can be used to modulate devices under test or one of a series of associated modulation test sets also available. VectorStar VNAs are available in frequency ranges from 70 kHz to 20, 40, 50 and 70 GHz, and as broadband systems from 70 kHz to 125 GHz. VectorStar can also provide frequency coverage up to 750 GHz, with mm-wave modules from either Virginia Diodes or OM. Anritsu www.anritsu.com Probing of 25-μm-diameter micro-bumps is a step towards 3D ICs Breakthrough probing results, achieved with CM300 probe system, are seen as an enabling technology for progress in the 3D IC market Cascade Microtech, wafer-probing specialist, and Belgian research centre imec, have announced breakthroughs in probing stacked integrated circuits (3D-SICs). Cascade partnered with imec to successfully probe 25-μm-diameter microbumps on a wide I/O test wafer with its fully-automated CM300 probe solution using an advanced version of Pyramid Probe technology. Through- Silicon Vias (TSV) used in 3D-SICs, shorten interconnects between logic elements, thus reducing power while increasing performance. Cascade Microtech’s CM300 flexible onwafer measurement system was designed to deliver superior positioning accuracy and repeatable contact, offering a level of precision that supports both shrinking pad sizes and pitch roadmaps. The CM300 captures the true electrical performance of devices with high-performance capabilities that include low leakage and low noise. The CM300 has proven to meet the fine-pitch (40-μm area array), low-force (< 1gf/ tip) advanced probing requirements of 3D-SICs. The probe solution is designed to provide greater alignment accuracy to probe directly on small, fragile micro-bumps. imec www.imec.be more information www.productronica.com/en/2013 efficient production management Highlight Segment 2013 20th international trade fair for innovative electronics production messe münchen november 12–15, 2013 www.productronica.com www.electronics-eetimes.com Electronic Engineering Times Europe September 2013 39 p13-Abdul_93x277-EETimesEur_E.indd 1 14.08.13 10:38


EETE SEPT 2013
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