Page 37

EETE SEP 2014

October 7–9 • Alpexpo • Grenoble, France www.semiconeuropa.org EXHIBITION AREAS • Semiconductor Manufacturing Equipment for Front-End and Back-End, Materials and Services • Electronic Components and Design (new) IC, ASIC, MEMS, Sensors, Design, Foundries, Flexible Electronics • Electronic Applications (new) Imaging, Energy Efficiency, Healthcare, Security • Allée des Clusters (new) • Innovation Village (new) • Science Park PROGRAM TOPICS • Semiconductor Technology including Fab Management, Automation, 450mm, Lithography, Metrology, New Materials • MEMS • Advanced Packaging and Test • Imaging Conference (new) • Low Power Conference (new) • Power Electronics Conference (new) • Plastic Electronics • Executive and Market Summit • Innovation Village (new) • Industrial Sites visits (new) Supported by: Register now online: QKUGf Use promotion code and save 25 Euro! Free access to SEMICON Europa 2014. www.semiconeuropa.org


EETE SEP 2014
To see the actual publication please follow the link above