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A46E_EETimesEuro_2_375x10_875_A45.qxd 8/6/14 DC-3 Series DC-1 Series Ultra-low-jitter programmable clock cuts power A universal-clock IC, the XR81112 series generates output frequencies from 10 MHz to 1.5 GHz with ultra-low phase noise jitter of less than 200 fsec that suits them for demanding communications, audio/video, and industrial applications. The 3x3mm QFN-12 packaged devices are the smallest available with this broad HiQP Series DC-DC CONVERTERS NEW!! HIGH INPUT VOLTAGES UP TO 900 VDC. DC-1 Series • 120-370 VDC input voltage range • 5-300 VDC regulated isolated outputs • Up to 300 watts output power • 4.5” X 2.5” X 0.50” encapsulated package • DC-3 Series • 300-900 VDC input voltage range • 3.3 -300 VDC regulated isolated outputs • Up to 50 watts, single and dual outputs • Thru hole and terminal strip models • HiQP Series • 125-475 VDC input voltage range • 24-200 VDC regulated isolated outputs • Up to 50 watts output power • 2.50” X 1.55” X 0.50” encapsulated package ALL MODELS AVAILABLE WITH EXPANDED OPERATING TEMPERATURES SELECTED MILITARY SCREENING CUSTOM DESIGNS For full characteristics of these and the entire PICO product line, see PICO’s Full line catalog at www.picoelectronics.com PICOELECTRONICS, Inc. Pico Representatives Germany ELBV/Electronische Bauelemente Vertrieb E-mail: info@elbv.de Phone: 0049 89 4602852 Fax: 0049 89 46205442 England Ginsbury Electronics Ltd. E-mail: rbennett@ginsbury.co.uk Phone: 0044 1634 298900 Fax: 0044 1634 290904 feature set. The clock synthesiser uses a flexible deltasigma modulator and a very wide-ranging VCO in a PLL block that has been optimised to be extremely power efficient. With a core current consumption of just 20 mA, these parts dissipate 60% less power than equivalent devices. The PLL can operate from either an input system clock or a crystal, and incorporates both an integer divider and a high-resolution (<1 Hz) fractional divider for increased flexibility to generate any clock frequency. Additionally, up to four different frequency multiplier settings can be stored, allowing for different application configurations and providing BOM savings compared to multiple synthesisers. The XR81112 is configurable for LVCMOS, LVDS or LVPECL outputs. Exar www.exar.com Voltage regulators connect directly to car battery With the introduction of 17 new AEC-Q100-qualified high-voltage LDOs, Texas Instruments further broadens its portfolio of low drop-out regulators. Designed for applications that connect directly to a car or truck battery, the new LDOs feature 60V input and ultra-low quiescent current. Target applications include instrument cluster, power steering, infotainment systems, door modules and lighting controls. The LDOs achieve quiescent current as low as 10 uA in standby mode, resulting in lower power consumption and increased battery life. Internal equivalent series resistance (ESR) compensation can help optimize system cost and stability. High input voltage allows automotive subsystems to connect directly to the car battery: the LDOs support input voltages of up to 40 V for normal operation and up to 45 V to support transient spikes in automotive designs. Additionally the TPS7A1601- Q1 can support up to 60 V normal operation for trucks and heavy-duty equipment. A tracking function allows for more accurate data from the off-board sensors. Texas Instruments www.ti.com Memsic launches monolithic 3-axis accelerometer Memsic has introduced what it claims is the world’s first monolithic 3D accelerometer and the first to make use of wafer-level packaging. The MXC400xXC makes use of Memsic’s patented thermal convection, heated gas method to detect acceleration and inclination. The method has been used for many years by Memsic in single-axis or dual-axis form for automotive stability control and rollover detection, digital cameras, projectors and many other applications. MEMSIC’s designers have now combined 3D sensing with wafer scale packaging to reduced cost and size for mobile applications such as phones, tablet computers, toys and wearable devices. Memsic claims to offer a 60 percent reduction in cost and a 50 percent reduction in size but only partially benchmarks what it is comparing the MXC400xXC against. The MXC400xXC provides 12-bit resolution on all three axes, programmable FSR of ±2g/±4g/ ±8g, an 8-bit temperature output, plus orientation/shake detection. With a package size of 1.2mm by 1.7mm, board space is reduced by 50 percent over 2x2mm industry-standard. Memsic Inc. www.memsic.com www.electronics-eetimes.com Electronic Engineering Times Europe September 2014 47


EETE SEP 2014
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